Digi XBee S2C 802.15.4 User Manual page 171

Migrate from XBee through-hole to surface-mount devices
The round holes in the diagram are for the TH design, and the semi-oval pads are for the SMT design.
Pin 1 of the TH design is lined up with pad 1 of the SMT design, but the pins are actually offset by one
pad; see Pin mapping. By using diagonal traces to connect the appropriate pins, the layout will work
for both devices.
PCB design and manufacturing
XBee/XBee-PRO S2C 802.15.4 RF Module User Guide
contains information on attaching the SMT device.
Mount the devices
171