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PCB design and manufacturing
Recommended solder reflow cycle
The following table provides the recommended solder reflow cycle. The table shows the temperature
setting and the time to reach the temperature; it does not show the cooling cycle.
Time (seconds)
30
60
90
120
150
180
210
The maximum temperature should not exceed 260 °C.
The device will reflow during this cycle, and therefore must not be reflowed upside down. Take care
not to jar the device while the solder is molten, as this can remove components under the shield from
their required locations.
Hand soldering is possible and should be performed in accordance with approved standards.
The device has a Moisture Sensitivity Level (MSL) of 3. When using this product, consider the relative
requirements in accordance with standard IPC/JEDEC J-STD-020.
In addition, note the following conditions:
a. Calculated shelf life in sealed bag: 12 months at < 40 °C and < 90% relative humidity (RH).
b. Environmental condition during the production: 30 °C /60% RH according to IPC/JEDEC J-STD-
033C, paragraphs 5 through 7.
c. The time between the opening of the sealed bag and the start of the reflow process cannot
exceed 168 hours if condition b) is met.
d. Baking is required if conditions b) or c) are not met.
e. Baking is required if the humidity indicator inside the bag indicates a RH of 10% more.
f. If baking is required, bake modules in trays stacked no more than 10 high for 4-6 hours at
125 °C.
Recommended footprint and keepout
We recommend that you use the following PCB footprints for surface-mounting. The dimensions
without brackets are in inches, and those in brackets are in millimeters.
XBee/XBee-PRO S2C 802.15.4 RF Module User Guide
Temperature (degrees C)
65
100
135
160
195
240
260
Recommended solder reflow cycle
173
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