Thermal Characteristics; Reference Document; Table 66. Package Thermal Characteristics - STMicroelectronics STM32F038C6 Manual

STM32F038x6
7.6

Thermal characteristics

The maximum chip junction temperature (T
Table 18: General operating
The maximum chip-junction temperature, T
using the following equation:
Where:
•
T max is the maximum ambient temperature in °C,
A
• Θ
JA
•
P max is the sum of P
D
•
P
INT
internal power.
P max represents the maximum power dissipation on output pins where:
I/O
P
I/O
taking into account the actual V
application.
Symbol
Θ
JA
7.6.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
conditions.
T
J
is the package junction-to-ambient thermal resistance, in ° C/W,
INT
max is the product of I
max = Σ (V ) + Σ ((V
× I
OL OL

Table 66. Package thermal characteristics

Thermal resistance junction-ambient
LQFP48 - 7 × 7 mm
Thermal resistance junction-ambient
UFQFPN32 - 5 × 5 mm
Thermal resistance junction-ambient
UFQFPN28 - 4 × 4 mm
Thermal resistance junction-ambient
WLCSP25 - 2.13 x 2.07 mm
Thermal resistance junction-ambient
TSSOP20 - 6.5 x 4.4 mm
DocID026079 Rev 3
max) must never exceed the values given in
J
max, in degrees Celsius, may be calculated
J
max = T max + (P max x Θ
A D
max and P max (P
I/O D
and V , expressed in Watts. This is the maximum chip
DD DD
– V ) × I
DDIOx OH
/ I and V / I
OL OL OH OH
Parameter
Package information
)
JA
max = P max + P
INT
),
OH
of the I/Os at low and high level in the
Value
55
38
118
74
110
max),
I/O
Unit
°C/W
95/102
98