Wlcsp25 Package Information; Table 63. Wlcsp25 Package Mechanical Data; Figure 39. Wlcsp25 Package Outline - STMicroelectronics STM32F038C6 Manual

STM32F038x6
7.4

WLCSP25 package information

WLCSP25 is a 25-ball, 2.423 x 2.325 mm, 0.4 mm pitch wafer level chip scale package.
1. Drawing is not to scale.
Symbol
A
A1
A2
(2)
A3
(3) (4)
b
D
E
e
e1
e2
F
G

Figure 39. WLCSP25 package outline

Table 63. WLCSP25 package mechanical data

millimeters
Min Typ
0.525 0.555
- 0.175
- 0.380
- 0.025
0.220 0.250
2.388 2.423
2.29 2.325
- 0.400
- 1.600
- 1.600
- 0.4115
- 0.3625
DocID026079 Rev 3
Max Min
0.585 0.0207
- -
- -
- -
0.280 0.0087
2.458 0.0940
2.36 0.0902
- -
- -
- -
- -
- -
Package information
(1)
inches
Typ Max
0.0219 0.0230
0.0069 -
0.0150 -
0.0010 -
0.0098 0.0110
0.0954 0.0968
0.0915 0.0929
0.0157 -
0.0630 -
0.0630 -
0.0162 -
0.0143 -
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