Table 64. Wlcsp25 Recommended Pcb Design Rules; Figure 40. Recommended Footprint For Wlcsp25 Package - STMicroelectronics STM32F038C6 Manual

Package information
Symbol
aaa
bbb
ccc
ddd
eee
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
4. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
Pitch
Dpad
Dsm
Stencil opening
Stencil thickness
90/102
Table 63. WLCSP25 package mechanical data (continued)
millimeters
Min Typ
- 0.100
- 0.100
- 0.100
- 0.050
- 0.050

Figure 40. Recommended footprint for WLCSP25 package

Table 64. WLCSP25 recommended PCB design rules

Dimension
DocID026079 Rev 3
Max Min
- -
- -
- -
- -
- -
Recommended values
0.4 mm
0.225 mm
0.290 mm typ. (depends on the soldermask
registration tolerance)
0.250 mm
0.100 mm
STM32F038x6
(1)
inches
Typ Max
0.0039 -
0.0039 -
0.0039 -
0.0020 -
0.0020 -