Figure 43. Recommended Footprint For Tssop20 Package - STMicroelectronics STM32F038C6 Manual

STM32F038x6
Symbol
k
aaa
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15mm per side.
3. Dimension "E1" does not include interlead flash or protrusions. Interlead flash or protrusions shall not
exceed 0.25mm per side.
1. Dimensions are expressed in millimeters.
Table 65. TSSOP20 package mechanical data (continued)
millimeters
Min. Typ.
0° -
- -

Figure 43. Recommended footprint for TSSOP20 package

DocID026079 Rev 3
Max. Min.
8° 0°
0.100 -
Package information
(1)
inches
Typ. Max.
- 8°
- 0.0039
93/102
98