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Note
5
Processor core and integrated graphics and memory controller junction temperatures are monitored
by their respective DTS. A DTS outputs a temperature relative to the maximum supported junction
temperature. The error associated with DTS measurements will not exceed ±5°C within the
operating range.
6
The power supply to the processor core and the integrated graphics /Memory core should be
designed as per Intel's guidelines.
7
Processor core currents is monitored by IMON VR feedback (ISENSE) and calculated using a moving
average method. Error associated with power monitoring will depend upon individual VR design.
8
A thermal solution for an power sharing enabled system needs to ensure that the Tj limit is not
exceeded while operating under the two extreme power conditions between the processor core and
the integrated graphics and memory controller components.
9
Projected range in advance of the measured product data. Measured values will be available after
silicon characterization.
10
For power sharing designs it is recommended to establish the full cooling capability within 10°C of
the T
specifications. Some processors may have a different Tj max value, please refer to the
j,max
processor Specification Update for details.
11
In rare occasions the specified maximum power limits may be violated when the package is not at a
thermally constrained environment
12
Tj, min =0 deg
13
While running intensive graphical and computational workloads simultaneously the concurrent
package power may exceed specified limits in exceptional occasions. Nevertheless, the individual
component powers are not to exceed the component TDPs specified.
Table 5-17.Intel Pentium U5000 mobile processor series Dual-Core ULV Thermal Power
Specifications
1,2,6,7
TDP
HFM
10.5
8.5
LFM
9
8.5
54
Definition
Frequency
166
18
1.20
up to
500
17.5
667 MHz
N/A
Power Sharing Design
8
Points
Proc: 10.5
Proc: 7
Int. Gfx:
Int Gfx:
7.5
11
N/A
N/A
Thermal Management
4,5,10,12
T
j,max
18
105
100
N/A
Datasheet
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