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3.5
Package Insertion Specifications
The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
3.6
Processor Mass Specification
The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
3.7
Processor Materials
Table 22
Table 22.
Processor Materials
Integrated Heat Spreader (IHS)
3.8
Processor Markings
Figure 9
can be used to aid in the identification of the processor.
®
Figure 9.
Intel
Pentium
Example
38
lists some of the package components and associated materials.
Component
Substrate
Substrate Lands
and
Figure 10
show the top-side markings on the processor. These diagrams
®
Dual-Core Processor E5000 Series Top-Side Markings
INTEL
Intel® Pentium® Dual-Core
SLAY7 [COO]
2.50GHZ/2M/800/06
[FPO]
Package Mechanical Specifications
Material
Nickel Plated Copper
Fiber Reinforced Resin
Gold Plated Copper
©'06 E5200
M
e
4
ATPO
S/N
Datasheet
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