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Mechanical Specifications
3
Mechanical Specifications
The Intel
package that interfaces with the motherboard via a mPGA604 socket. The package
consists of two processor dies mounted on a substrate pin-carrier. An IHS is attached
to the package substrate and die and serves as the mating surface for processor
component thermal solutions, such as a heatsink.
processor package components and how they are assembled together. Refer to the
mPGA604 Socket Design Guidelines for complete details on the mPGA604 socket.
The package components shown in
1. IHS
2. Processor die
3. FC-mPGA6 package
4. Pin-side capacitors
5. Package pin
Figure 3-1.
Processor Package Assembly Sketch
Note:
Figure 3-1
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
1. Package reference with tolerances (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Pin dimensions
4. Top-side and back-side component keepout dimensions
5. Reference datums
All drawing dimension are in mm [in].
Document Number: 318080-002
®
®
Xeon
Processor 7200 Series and 7300 Series is packaged in a FC-mPGA6
is not to scale and is for reference only. The mPGA604 socket is not shown.
Figure 3-1
Figure 3-1
include the following:
Figure 3-2
shows a sketch of the
and
Figure
3-3. The
57
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