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Summary of Contents for Intel WiFi Link 5100
- Page 1 ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications Thermal/Mechanical Design Guide July 2008 Revision 003US Order Number: 318676-003US...
- Page 2 Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548- 4725, or by visiting Intel’s Web...
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Page 3: Table Of Contents
® Intel 5100 MCH Chipset Contents Introduction ... 6 Design Flow... 6 Definition of Terms ... 7 Related Documents ... 8 Thermal Simulation ... 9 Packaging Technology ... 9 Package Mechanical Requirements ... 11 Thermal Specifications ... 12 Thermal Design Power (TDP) ... 12 Case Temperature ... - Page 4 TIM2 Drawing ...39 Tables Definition of Terms ... 7 Related Documents... 8 ® Intel 5100 Memory Controller Hub Chipset Thermal Specifications...12 Required Heatsink Thermal Performance (Ψ Thermocouple Attach Support Equipment ...16 Honeywell* PCM45F TIM Performance as Function of Attach Pressure ...28 Reliability Guidelines ...29...
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Page 5: Revision History
® Intel 5100 MCH Chipset Revision History Date Revision Description Added the CompactPCI* reference solution July 2008 Added Figure Updated the supplier information February 2008 Updated the TDP November 2007 Initial release Revision Number Descriptions Revision Associated Life Cycle Milestone POP L3 Closure 0.1–0.4... -
Page 6: Introduction
This document addresses thermal design and specifications for the Intel Chipset components only. For thermal design information on other chipset components, refer to the respective component datasheet. For the ICH9R, refer to the Intel Controller Hub 9 (ICH9) Family Thermal and Mechanical Design Guidelines. -
Page 7: Definition Of Terms
® Intel 5100 MCH Chipset Figure 1. Thermal Design Process Step 1: Thermal Simulation • Package Level Thermal Models • Thermal Model User’s Guide Definition of Terms Table 1. Definition of Terms Term FC-BGA ICH9 case_max case_min Ψ Ψ Ψ... -
Page 8: Related Documents
® Intel Electronic Design Kits (EDKs) provide online, real-time collateral updates. The following links take you to the EDK server and require you to log into Intel Link (IBL). • Quad-Core and Dual-Core Intel® Xeon® Processor 5000 Sequence with Intel®... -
Page 9: Thermal Simulation
Applications Thermal and Mechanical Design Guidelines Various system thermal design suggestions Notes: Contact your Intel sales representative. Some documents may not be available at this time. Thermal Simulation Intel provides thermal simulation models of the Intel associated user’s guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. -
Page 10: Mch Package Dimensions (Top View)
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications 38.5 mm, 38.5 mm. -
Page 11: Package Mechanical Requirements
All dimensions and tolerances conform to ANSI Y14.5M-1994. Package Mechanical Requirements ® The Intel 5100 MCH Chipset package has an integrated heat spreader (IHS) that is capable of sustaining a maximum static normal load of 15 lbf. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition. -
Page 12: Thermal Specifications
Analysis indicates that real applications are unlikely to cause the MCH component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). -
Page 13: Processor Thermal Characterization Parameter Relationships
® Intel 5100 MCH Chipset The case-to-local ambient thermal characterization parameter (Ψ measure of the thermal performance of the overall thermal solution. It is defined by Equation 1 and is measured in units of °C/W. Equation 1. Case-to-local Ambient Thermal Characterization Parameter (Ψ... - Page 14 This effect can contribute to a more reasonable thermal solution including reduced cost, heatsink size, heatsink weight, and a lower system airflow rate. ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications Equation 2 to determine the required thermal performance = 105 °C...
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Page 15: Thermal Metrology
5100 MCH Chipset @ 25 W Thermal Metrology The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the MCH case temperatures. how to accurately measure the MCH case temperatures. -
Page 16: Thermal Calibration And Controls
It is recommended to follow company standard procedures and wear safety items like glasses for cutting the IHS and gloves for chemical handling. Note: Ask your Intel field sales representative if you need assistance to groove and/or install a thermocouple according to the reference process. 5.1.3... -
Page 17: Ihs Groove Dimensions
® Intel 5100 MCH Chipset Figure 6. IHS Groove Dimensions ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 Order Number: 318676-003US... -
Page 18: Thermocouple Conditioning And Preparation
MCH IHS. 1. Clean the thermocouple wire groove with isopropyl alcohol (IPA) and a lint-free cloth removing all residue prior to thermocouple attachment. ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications Table (Figure ®... -
Page 19: Securing Thermocouple Wires With Kapton Tape Prior To Attach
® Intel 5100 MCH Chipset 2. Place the thermocouple wire inside the groove letting the exposed wire and bead extend about 3.2 mm (0.125") past the end of the groove. Secure it with Kapton tape (Figure 3. Lift the wire at the middle of groove with tweezers and bend the front of the wire to... -
Page 20: Thermocouple Bead Placement
Figure 10. Thermocouple Bead Placement Figure 11. Positioning Bead on Groove ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications ® Intel 5100 MCH Chipset July 2008 Order Number: 318676-003US... -
Page 21: Using 3D Micromanipulator To Secure Bead Location
® Intel 5100 MCH Chipset Figure 12. Using 3D Micromanipulator to Secure Bead Location Figure 13. Measuring Resistance between Thermocouple and IHS ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 Order Number: 318676-003US... -
Page 22: Curing Process
7. Curing time for the rest of the adhesive in the groove can be reduced using the Locite* 7452 Tak Pak* accelerator. 8. Repeat step mechanical contact to the heatsink surface. ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications Section 5.1.4, step 2., and (Figure 15). -
Page 23: Thermocouple Wire Management
® Intel 5100 MCH Chipset 5.1.7 Thermocouple Wire Management Figure 15. Thermocouple Wire Management in Groove Figure 16. Removing Excess Adhesive from IHS ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 Order Number: 318676-003US... -
Page 24: Power Simulation Software
Intel Hub Chipset (embedded) – Maximum Power Application. Reference Thermal Solution Intel has developed two reference thermal solutions that meet the cooling needs of the ® Intel 5100 MCH Chipset under the embedded operating environments and specifications defined in this document. -
Page 25: Advancedtca* Reference Heatsink
The Intel 5100 MCH Chipset has a lower TDP than the Intel a similar package size. Due to this, any thermal solutions for the Intel Chipset should be reusable for the Intel reference solutions. The system designer still needs to verify that the entire thermal solution will meet the component temperature specifications and TDP in the intended system. -
Page 26: Board-Level Components Keepout Dimensions
6.1.3 Board-level Components Keepout Dimensions The location of hole patterns and keepout zones for the AdvancedTCA* reference thermal solution are shown in hole patterns as that of the Intel Chipset. 6.1.4 Torsional Clip Heatsink Thermal Solution Assembly The reference thermal solution for the MCH is a passive extruded heatsink with a thermal interface. -
Page 27: Heatsink Orientation
® Intel 5100 MCH Chipset Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix solution component. 6.1.5 Heatsink Orientation Because this solution is based on a unidirectional heatsink, the mean airflow direction must be aligned with the direction of the heatsink fins. -
Page 28: Effect Of Pressure On Tim Performance
TIM is shown in Table Intel provides both End of Line and End of Life TIM thermal resistance values of Honeywell* PCM45F. End of Line and End of Life TIM thermal resistance values are obtained through measurement on a Test Vehicle similar to the Intel Chipset’s physical attributes using an extruded aluminum heatsink. -
Page 29: Reliability Guidelines
Additional pass/fail criteria may be added at the discretion of the user. CompactPCI* Reference Heatsink Intel has also developed a reference thermal solution compatible with the CompactPCI* form factor. The reference solution was developed assuming a maximum ambient temperature of 67 °C with a minimum volumetric airflow rate of 10 CFM through each slot. -
Page 30: Thermal Solution Performance Characteristics
The above tests should be performed on a sample size of at least 12 assemblies from three lots of material. Additional pass/fail criteria may be added at the discretion of the user. ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications CompactPCI* Heatsink... -
Page 31: Appendix A Mechanical Drawings
® Intel 5100 MCH Chipset Appendix A Mechanical Drawings Table 9 lists the mechanical drawings included in this appendix. Table 9. Mechanical Drawing List Drawing Description AdvancedTCA* Heatsink Assembly AdvancedTCA* Heatsink AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly CompactPCI* Heatsink... -
Page 32: Advancedtca* Heatsink Assembly Drawing
® Intel 5100 MCH Chipset Figure 23. AdvancedTCA* Heatsink Assembly Drawing ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 Order Number: 318676-003US... -
Page 33: Advancedtca* Heatsink Drawing
® Intel 5100 MCH Chipset Figure 24. AdvancedTCA* Heatsink Drawing ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 Order Number: 318676-003US... -
Page 34: Advancedtca* Component Keepout Zone
® Intel 5100 MCH Chipset Figure 25. AdvancedTCA* Component Keepout Zone ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 Order Number: 318676-003US... -
Page 35: Compactpci* Heatsink Assembly Drawing
® Intel 5100 MCH Chipset Figure 26. CompactPCI* Heatsink Assembly Drawing ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 Order Number: 318676-003US... -
Page 36: Compactpci* Heatsink Drawing
® Intel 5100 MCH Chipset Figure 27. CompactPCI* Heatsink Drawing ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 Order Number: 318676-003US... -
Page 37: Compactpci* Component Keepout Zone
® Intel 5100 MCH Chipset Figure 28. CompactPCI* Component Keepout Zone ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 Order Number: 318676-003US... -
Page 38: Torsional Clip Heatsink Clip Drawing
® Intel 5100 MCH Chipset Figure 29. Torsional Clip Heatsink Clip Drawing ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 Order Number: 318676-003US... -
Page 39: Tim2 Drawing
® Intel 5100 MCH Chipset Figure 30. TIM2 Drawing ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 Order Number: 318676-003US... -
Page 40: Appendix B Thermal Solution Component Suppliers
The enabled components may not be currently available from all suppliers. Contact the supplier directly to verify the time of component availability. ® Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications Intel Part Number Supplier (Part Number) Cooler Master* D96852-001 (ECC-00527-01-GP)
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