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Table 6-3.
Quad-Core Intel® Xeon® X7350 Processor Thermal Specifications
Core
Frequency
Launch to FMB
Notes:
1.
These values are specified at V
the processor is not to be subjected to any static V
specified I
2.
Maximum Power is the highest power the processor will dissipate, regardless of its VID. Maximum Power is
measured at maximum T
3.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
4.
These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
5.
Power specifications are defined at all VIDs found in
shipped under multiple VIDs for each frequency.
6.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Figure 6-2.Quad-Core Intel® Xeon® X7350 Processor Thermal Profile
Notes:
1.
Thermal Profile is representative of a volumetrically unconstrained platform. Please refer to
discrete points that constitute the thermal profile.
2.
Implementation of Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet processor Thermal Profile will result in increased probability of TCC
activation and may incur measurable performance loss. (See
3.
Refer to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300
Series Thermal / Mechanical Design Guide for system and environmental implementation details.
98
Thermal
Minimum
Design Power
T
(W)
(°C)
130
for all processor frequencies. Systems must be designed to ensure
CC_MAX
. Please refer to the loadline specifications in
CC
.
CASE
70.00
60.00
50.00
40.00
30.00
20.00
0
10
20
30
40
Maximum
T
CASE
CASE
(°C)
5
See
Figure
6-2;
Table
6-4;
and I
combination wherein V
CC
CC
Section
2.
Table
2-3. The Intel® Xeon® X7350 Processor may be
Therm al Profile
T
= 0.162 x Pow er + 45
case
50
60
70
80
90
Po w er ( W )
Section 6.2
Thermal Specifications
Notes
1, 2, 3, 4, 5, 6
exceeds V
CC
CC_MAX
.
CASE
100
110
120
130
Table 6-4
for details on TCC activation).
Document Number: 318080-002
at
for
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