Intel 7512 Thermal/Mechanical Design Manuallines
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Intel 7512 Thermal/Mechanical Design Manuallines

Intel 7512 Thermal/Mechanical Design Manuallines

Scalable memory buffer
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Intel
7500, 7510, and 7512
Scalable Memory Buffer
Thermal/Mechanical Design Guidelines
April 2011
Reference Number: 322828-002

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Summary of Contents for Intel 7512

  • Page 1 ® Intel 7500, 7510, and 7512 Scalable Memory Buffer Thermal/Mechanical Design Guidelines April 2011 Reference Number: 322828-002...
  • Page 2 The Intel 7500, 7510, and 7512 Scalable Memory Buffer may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available upon request.

  • Page 3: Table Of Contents

    Clip Retention Anchors ................33 Reliability Guidelines..................33 Thermal Solution Component Suppliers ..............35 Tall Torsional Clip Heatsink Thermal Solution ............35 Short Torsional Clip Heatsink Thermal Solution............36 Mechanical Drawings ....................37 Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...
  • Page 4 Honeywell PCM45 F* TIM Performance as a Function of Attach Pressure ....27 Anchor Bend Angle and Maximum Pullout Force as a Function of Board Thickness ..28 Reliability Guidelines ..................28 Mechanical Drawing List..................37 Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 5: Revision History

    Description Date Initial Release April 2010 • Added product specifications for Intel 7510 and 7512 Scalable Memory buffer • Replaced reference to ‘Intel 7500 Scalable Memory Buffer’ with ‘components’ where guidance also applies to Intel 7510 and 7512 Scalable Memory Buffer. See change bars throughout document.
  • Page 6 Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 7: Introduction

    • Outline the mechanical operating limits and specifications for the Intel 7500, 7510, and 7512 Scalable Memory Buffer (MB). • Outline reference TDP specifications for the Intel 7500, 7510, and 7512 Scalable ® ® Memory Buffer specific to that of Intel...

  • Page 8: Definition Of Terms

    Note that the device arrives at the customer with solder balls attached. Bond Line Thickness. Final settled thickness of the thermal interface material after installation of heatsink. Intel 7500 Scalable Memory Buffer. The chipset component responsible for ® ® handling Intel...

  • Page 9: Reference Documents

    The reader of this specification should also be familiar with material and concepts presented in the following documents: ® • Intel 7500, 7510, and 7512 Scalable Memory Buffer Datasheet • Various system thermal design suggestions (http://www.formfactors.org) § Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...
  • Page 10 Introduction Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 11: Packaging Technology

    Packaging Technology Packaging Technology The Intel 7500, 7510, and 7512 Scalable Memory Buffer components uses a 24.5 mm x 19.5 mm, 12-layer FC-BGA package (see Figure 2-1, Figure 2-2 Figure 2-3). Figure 2-1. Scalable Memory Buffer Package Dimensions (Top View)

  • Page 12: Scalable Memory Buffer Package Dimensions (Bottom View)

    Packaging Technology Figure 2-3. Scalable Memory Buffer Package Dimensions (Bottom View) Notes: All dimensions are in millimeters. All dimensions are tolerances confirm to ANSI Y14.5M-1994. Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 13: Package Mechanical Requirements

    2. These specifications apply to uniform compressive loading in a direction perpendicular to the bare die top surface. 3. These specifications are based on limited testing for design characterization. Loading limits are for the package only. § Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...
  • Page 14 Packaging Technology Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 15: Thermal Specifications

    4 memory DIMMs. See specific memory buffer datasheet or electronic design specification documents for additional information. TDP values for the memory buffers are based on loading Quad Rank, two DIMM per Channel per Intel 7510/7512 Scalable Memory Buffer. When Intel 7510/7512 Scalable Memory Buffer is used with the Intel® Xeon® processor 7500/6500 series, only the Intel 7500 Scalable Memory Buffer feature set is supported and validated;...

  • Page 16: Intel 7500 Scalable Memory Buffer Thermal Specification

    Notes: Tcase_min and Tcase_max represent the operating temperature range of the memory buffer. For additional information on memory buffer thermal specifications Refer to the Intel® 7500,7510, and 7512 Scalable Memory Buffer Datasheet. Refer to the Intel® 7500, 7510, 7512 Scalable Memory Buffer Datasheet for thermal management mechanism and Tcontrol usage.

  • Page 17: Thermal Metrology

    Intel has established guidelines for proper techniques to measure the component die temperatures. Section 4.1 provides guidelines on how to accurately measure the Intel 7500 Scalable Memory Buffer die temperatures. Die Temperature Measurements To ensure functionality and reliability, the component T...

  • Page 18: Thermal Solution Decision Flowchart

    Specification? the system in the device die reflow desired temperature. process. configuration. Select Heatsink Heatsink Required Figure 4-2. Zero Degree Angle Attach Heatsink Modifications Note: Not to scale. Intel® 7500, 7510, 7512 Scalable Memory Buffer TMDG...

  • Page 19: Zero Degree Angle Attach Methodology (Top View)

    Thermal Metrology Figure 4-3. Zero Degree Angle Attach Methodology (Top View) Thermocouple Wire Cement + Thermocouple Bead Substrate Note: Not to scale. § Intel® 7500, 7510, 7512 Scalable Memory Buffer TMDG...
  • Page 20 Thermal Metrology Intel® 7500, 7510, 7512 Scalable Memory Buffer TMDG...

  • Page 21: Reference Thermal Solution 1

    Reference Thermal Solution 1 Reference Thermal Solution 1 Intel has developed two different reference thermal solutions to meet the cooling needs of the components under operating environments and specifications defined in this document. This chapter describes the overall requirements for the tall torsional clip heatsink reference thermal solution, including critical-to-function dimensions, operating environment, and validation criteria.

  • Page 22: Heatsink Performance

    Q - “velocity through heatsink fin area (m/s)”. Velocity is the value on X axis of Figure 5-1. - Air density at given altitude - Air density at sea level Figure 5-1. Tall Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 23: Mechanical Design Envelope

    Note: All heights shown are maximum values. Board-Level Components Keepout Dimensions The location of hole patterns and keepout zones for the reference thermal solution are shown in Figure 5-3 Figure 5-4. Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 24: Tall Torsional Clip Heatsink Board Component Keepout

    Reference Thermal Solution 1 Figure 5-3. Tall Torsional Clip Heatsink Board Component Keepout Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 25: Tall Torsional Clip Heatsink Thermal Solution Assembly

    Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix Appendix A contains vendor information for each thermal solution component. Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 26: Heatsink Orientation

    Other heatsinks with similar dimensions and increased thermal performance may be available. Full mechanical drawings of this heatsink are provided in Appendix Figure 5-6. Tall Torsional Clip Heatsink Extrusion Profile Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 27: Mechanical Interface Material

    Table 5-1. Intel provides both End of Line and End of Life TIM thermal resistance values for Honeywell PCM45 F. End of Line and End of Life TIM thermal resistance values are obtained through measurement on a Test Vehicle similar to the component’s physical attributes using an extruded aluminum heatsink.

  • Page 28: Reliability Guidelines

    It is recommended that the above tests be performed on a sample size of at least twelve assemblies from three lots of material. Additional inspection guidelines may be added at the discretion of the user. § Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 29: Reference Thermal Solution 2

    Reference Thermal Solution 2 Reference Thermal Solution 2 Intel has developed two different reference thermal solutions to meet the cooling needs of the components under operating environments and specifications defined in this document. This chapter describes the overall requirements for the short torsional clip heatsink reference thermal solution, including critical-to-function dimensions, operating environment, and validation criteria.

  • Page 30: Heatsink Performance

    Q - “velocity through heatsink fin area (m/s)”. Velocity is the value on X axis of Figure 6-1. - Air density at given altitude - Air density at sea level Figure 6-1. Short Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 31: Mechanical Design Envelope

    Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix Appendix A contains vendor information for each thermal solution component. Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 32: Heatsink Orientation

    Other heatsinks with similar dimensions and increased thermal performance may be available. Full mechanical drawings of this heatsink are provided in Appendix Figure 6-4. Short Torsional Clip Heatsink Extrusion Profile Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 33: Mechanical Interface Material

    Section 5.5.4 for details. 6.5.5 Heatsink Clip Refer to Section 5.5.5 for details. 6.5.6 Clip Retention Anchors Refer to Section 5.5.6 for details. Reliability Guidelines Refer to Section 5.6 for details. § Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...
  • Page 34 Reference Thermal Solution 2 Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 35: A Thermal Solution Component Suppliers

    Tel:(909)978-6499 Fax:(909)978-6515 Notes: Contact the supplier directly to verify time of component availability. Anchor is independent of heatsink assembly. Proper Anchor selection will protect the chipset heatsink from shock and vibration. Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 36: Short Torsional Clip Heatsink Thermal Solution

    Notes: Contact the supplier directly to verify time of component availability. Anchor is independent of heatsink assembly. Proper Anchor selection will protect the chipset heatsink from shock and vibration. § Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 37: B Mechanical Drawings

    Tall/Short Torsional Clip Heatsink Clip Drawing Figure B-4 Short Torsional Clip Heatsink Assembly Orientation A Drawing Figure B-5 Short Torsional Clip Heatsink Assembly Orientation B Drawing Figure B-6 Short Torsional Clip Heatsink Drawing Figure B-7 Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 38: Tall Torsional Clip Heatsink Assembly Orientation A Drawing

    Mechanical Drawings Figure B-1. Tall Torsional Clip Heatsink Assembly Orientation A Drawing Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 39: Tall Torsional Clip Heatsink Assembly Orientation B Drawing

    Mechanical Drawings Figure B-2. Tall Torsional Clip Heatsink Assembly Orientation B Drawing Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 40: Tall Torsional Clip Heatsink Drawing

    Mechanical Drawings Figure B-3. Tall Torsional Clip Heatsink Drawing Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 41: Tall/Short Torsional Clip Heatsink Clip Drawing

    Mechanical Drawings Figure B-4. Tall/Short Torsional Clip Heatsink Clip Drawing Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 42: Short Torsional Clip Heatsink Assembly Orientation A Drawing

    Mechanical Drawings Figure B-5. Short Torsional Clip Heatsink Assembly Orientation A Drawing Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 43: Short Torsional Clip Heatsink Assembly Orientation B Drawing

    Mechanical Drawings Figure B-6. Short Torsional Clip Heatsink Assembly Orientation B Drawing Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

  • Page 44: B-7 Short Torsional Clip Heatsink Assembly

    Mechanical Drawings Figure B-7. Short Torsional Clip Heatsink Assembly § Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG...

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