Quectel SG865W Series Hardware Design page 7

4.12. LCM Interfaces ........................................................................................................................ 71
4.13. Touch Panel Interfaces ............................................................................................................ 74
4.14. Camera Interfaces ................................................................................................................... 75
4.14.1. Design Considerations ................................................................................................... 81
4.14.2. Flashlight Interfaces ....................................................................................................... 86
4.15. Sensor Interfaces .................................................................................................................... 86
4.16. Audio Interfaces ...................................................................................................................... 87
4.17. I2S Interfaces .......................................................................................................................... 88
4.18. SPI Interfaces .......................................................................................................................... 89
4.19. USB_BOOT ............................................................................................................................. 90
5 RF Specifications ............................................................................................................................... 91
5.1. RF Antenna Interface .............................................................................................................. 91
5.1.1. Antenna Interface and Frequency Bands ...................................................................... 91
5.1.2. Reference Design .......................................................................................................... 91
5.2. RF Performance ...................................................................................................................... 92
5.2.1. Wi-Fi Overview ............................................................................................................... 93
5.2.2. Bluetooth Overview ........................................................................................................ 96
5.3. Reference Design of RF Routing ............................................................................................ 97
5.4. Antenna Design Requirements ............................................................................................... 98
5.5. RF Connector Recommendation ............................................................................................ 99
6 Electrical Characteristics & Reliability .......................................................................................... 101
6.1. Absolute Maximum Ratings .................................................................................................. 101
6.2. Power Supply Ratings ........................................................................................................... 101
6.3. Power Consumption .............................................................................................................. 102
6.4. Digital I/O Characteristic ....................................................................................................... 102
6.5. ESD Protection ...................................................................................................................... 103
6.6. Operating and Storage Temperatures ................................................................................... 103
7 Mechanical Information ................................................................................................................... 104
7.1. Mechanical Dimensions ........................................................................................................ 104
7.2. Recommended Footprint ....................................................................................................... 106
7.3. Top and Bottom Views........................................................................................................... 107
8 Storage, Manufacturing & Packaging ............................................................................................ 108
8.1. Storage Conditions ................................................................................................................ 108
8.2. Manufacturing and Soldering ................................................................................................ 109
8.3. Packaging Specifications .......................................................................................................111
8.3.1. Carrier Tape ...................................................................................................................111
8.3.2. Plastic Reel ...................................................................................................................111
8.3.3. Packaging Process ...................................................................................................... 112
9 Appendix References ...................................................................................................................... 113
SG865W_Series_Hardware_Design
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