Table of Contents
Advertisement
Material
Declaration
P601 -00-700
Issue
E
In accordance with the requirements of the Chinese regulatory requirement on the Management Methods for the
Restriction of the Use of Hazardous Substances in Electrical and Electronic Products Order No. 32 (also known as
'China RoHS2'
)
and
SJ/
T 11364 Marking for the Restricted Use of Hazardous Substances in Electronic and Electrical
Products:
Product
Product Labels
Meaning
All iH models
~
This product contains hazardous substances in at
All iGX models
least one of the homogeneous materials used which
All GX models
are above the limit requirement in GB
/
T 26572 as
All EPX models
detailed in the declaration table below.
Tool Interface (Micro
TIM)
(if
fitted)
These parts can safely be used for the
environmental protection use period as indicated.
t~IH!t-~:M:
m
~
Part name
Lead
Mercury
(Pb)
(Hg)
t!L7E
X
0
Enclosure
fl!t!l<*~t!l~:tt
II*)
Motors (pump and
X
0
mechanical
booster)
*~:ttlli*
X
0
Pump and booster
1' 1 !
=f7G14'~~1tf:
Electronics and
X
0
Controls
;.Hp~~
X
0
Cooling system
~B~~
X
0
Purge system
t!Lilf&r:J
X
0
Tool Interface
~~fiHtF"~
Materials
Content Declaration
li*~l!li
Hazardous Substances
m
:f.\
1ft
ill
$~~*
Cadmium
Hexavalent
Polybrominated
Chromium
biphenyls
(Cd)
(CrVI)
(PBB)
0
0
0
0
0
0
0
0
0
X
0
0
0
0
0
0
0
0
0
0
0
0:
~ff-~li~4ml!li.f£1Hl'!#Bt!Mli~l!li:ft~-l-!f!Btl~mf~-=f
GB/
T 26572
fif,i!Em\5EBtl~~m~31(.
$~
-*M
Polybrominated
diphenyl
ethers
(PBDE)
0
0
0
0
0
0
0
0
:
Indicates that the hazardous substance contained in all of the homogeneous materials for this part is
below the limit requirement in
GB/
T 26572.
X:
~ff-~li~4ml!li.f£~H!l14'Bt1~:1> -:ftl•~l!li~~
!f!
Btl~mi!il:±l
GB/
T26572
f;f,ftHli!5EBtlll&m~31(.
X: Indicates that the hazardous
substance
contained in at least one of the homogeneous materials used for
t his part is above the limit requirement of
GB/
T26572.
NOTE: These
products
are
EU RoHS compliant,
the following Exemptions apply:
6(b) Lead
as an
alloying
element
in
aluminium
containing
up
t
o 0.4% by
weight
6(c) Copper
alloy
containing up
to 4%
lead
by w eight
7(a)
Lead in
in
high
melting temperature type
solder
(i.e.
lead based alloys
containing
85% by
or
more)
7(b) Lead in
solders for servers,
storage
and storage array systems, network
infrastructure
equipment
for switching, signalling,
transmission, and net
w ork management
for t elecommunications
(c)
I
Electrical
and electronic components
cont aining lead
in
a glass or ceramic
other than
dielectric ceramic in
capacit
ors,
e.g.
piezoelectronic devices,
or
in a glass or ceramic
matrix
compound
7(c)
II Lead
in dielectric ceramic
in
capacitors f or
a
rated
voltage
of 125 V AC or 250 V DC or
higher
8(b)
Cadmium
and its compounds
in
electrical
contacts
15
Lead
i
n solders
t
o complete a viable
elect
rical
connection between semiconductor
die and
carrier
w
ithin integrat ed circuit
flip
chip packages
34
Lead in cermet-based
t rimmer potent
iometer
elements
Advertisement
Table of Contents
