Outline Dimensions - Analog Devices ADV7181BCP Manual

OUTLINE DIMENSIONS

1.00
0.85
0.80
Downloaded from Elcodis.com electronic components distributor
9.00
BSC SQ
PIN 1
INDICATOR
TOP
BSC SQ
VIEW
0.80 MAX
12° MAX
0.65 TYP
0.50 BSC
SEATING
PLANE
* COMPLIANT TO JEDEC STANDARDS MO-220-VMMD
EXCEPT FOR EXPOSED PAD DIMENSION
Figure 46. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
1.45
0.20
1.40
0.09
1.35
3.5°
SEATING
0.08 MAX
PLANE
COPLANARITY
VIEW A
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026-BCD
Figure 47. 64-Lead Low Profile Quad Flat Package [LQFP]
0.60 MAX
0.60 MAX
49
48
8.75
EXPOSED PAD
(BOTTOM VIEW)
0.45
0.40
33
32
0.35
7.50
REF
0.05 MAX
0.02 NOM
0.20 REF
9 × 9 mm Body, Very Thin Quad (CP-64-3)
Dimensions shown in millimeters
0.75
0.60
1.60
MAX
0.45
64
1
PIN 1
7°
16
0°
17
VIEW A
0.50
BSC
LEAD PITCH
(ST-64-2)
Dimensions shown in millimeters
Rev. B | Page 99 of 100
0.30
0.25
0.18
PIN 1
INDICATOR
64
1
* 7.25
7.10 SQ
6.95
16
17
0.25 MIN
THE EXPOSED METAL PADDLE ON THE
BOTTOM OF THE LFCSP PACKAGE MUST
BE SOLDERED TO PCB GROUND FOR PROPER
HEAT DISSIPATION AND ALSO FOR NOISE
AND MECHANICAL STRENGTH BENEFITS.
12.00
BSC SQ
49
48
10.00
TOP VIEW
BSC SQ
(PINS DOWN)
33
32
0.27
0.22
0.17
ADV7181B