Outline Dimensions; Ordering Guide - Analog Devices AD9776A Manual

AD9776A/AD9778A/AD9779A

OUTLINE DIMENSIONS

NOTES
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF

ORDERING GUIDE

Model
1
AD9776ABSVZ
1
AD9776ABSVZRL
1
AD9778ABSVZ
1
AD9778ABSVZRL
1
AD9779ABSVZ
1
AD9779ABSVZRL
1
AD9776A-EBZ
1
AD9778A-EBZ
1
AD9779A-EBZ
1
Z = RoHS Compliant Part.
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16.00 BSC SQ
1.20
0.75
MAX
0.60
0.45
100
1
SEATING
PIN 1
PLANE
TOP VIEW
(PINS DOWN)
25
26
0.20
0.09
7°
3.5°
0°
0.50 BSC
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE
DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
Figure 113. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
Temperature Range Package Description
−40°C to +85°C 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
−40°C to +85°C 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
−40°C to +85°C 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
−40°C to +85°C 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
−40°C to +85°C 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
−40°C to +85°C 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
Evaluation Board
Evaluation Board
Evaluation Board
D06452-0-3/08(A)
14.00 BSC SQ
76 76
75
75
51
51
50 50
1.05
1.00
0.95
0.15
COPLANARITY
0.27
0.08
0.05
0.22
0.17
(SV-100-1)
Dimensions shown in millimeters
Rev. A | Page 60 of 60
100
1
BOTTOM VIEW
(PINS UP)
CONDUCTIVE
HEAT SINK
25
26
6.50
NOM
Package Option
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1