Outline Dimensions - Analog Devices ADV7181B Manual

OUTLINE DIMENSIONS

1.00
12° MAX
0.85
0.80
SEATING
PLANE
9.00
BSC SQ
0.60 MAX
PIN 1
INDICATOR
8.75
TOP
BSC SQ
VIEW
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.50 BSC
0.20 REF
* COMPLIANT TO JEDEC STANDARDS MO-220-VMMD
EXCEPT FOR EXPOSED PAD DIMENSION
Figure 46. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 × 9 mm Body, Very Thin Quad (CP-64-3)
Dimensions shown in millimeters
0.75
0.60
0.45
1.45
0.20
1.40
0.09
1.35
7°
3.5°
0°
SEATING
0.08 MAX
PLANE
COPLANARITY
VIEW A
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026-BCD
Figure 47. 64-Lead Low Profile Quad Flat Package [LQFP]
Dimensions shown in millimeters
0.30
0.25
0.60 MAX
0.18
49 64
48
EXPOSED PAD
(BOTTOM VIEW)
0.45
0.40
33
32 17
0.35
7.50
REF
12.00
BSC SQ
1.60
MAX
64
1
PIN 1
TOP VIEW
(PINS DOWN)
16
17
VIEW A
0.50
BSC
LEAD PITCH
(ST-64-2)
Rev. B | Page 99 of 100
PIN 1
INDICATOR
1
* 7.25
7.10 SQ
6.95
16
0.25 MIN
THE EXPOSED METAL PADDLE ON THE
BOTTOM OF THE LFCSP PACKAGE MUST
BE SOLDERED TO PCB GROUND FOR PROPER
HEAT DISSIPATION AND ALSO FOR NOISE
AND MECHANICAL STRENGTH BENEFITS.
49
48
10.00
BSC SQ
33
32
0.27
0.22
0.17
ADV7181B