Thermal Specifications; Timing Diagrams; Changes To Table 5 - Analog Devices ADV7181BCP Manual

THERMAL SPECIFICATIONS

Table 5.
1, 2
Parameter
THERMAL CHARACTERISTICS
Junction-to-Ambient Thermal
Resistance (Still Air)
Junction-to-Case Thermal Resistance
Junction-to-Ambient Thermal
Resistance (Still Air)
Junction-to-Case Thermal Resistance
1 Temperature range: T
2 The min/max specifications are guaranteed over this range.

TIMING DIAGRAMS

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Symbol
θ
JA
θ
JC
θ
JA
θ
JC
to T , –40°C to +85°C
MIN MAX
t
3
SDA
SCLK
t
2
OUTPUT LLC
OUTPUTS P0–P15, VS,
HS, FIELD,
SFL
Test Conditions
4-layer PCB with solid ground plane, 64-lead LFCSP
4-layer PCB with solid ground plane, 64-lead LFCSP
4-layer PCB with solid ground plane, 64-lead LQFP
4-layer PCB with solid ground plane, 64-lead LQFP
t
5
t
t
1
6
t
7
2
Figure 2. I C Timing
t t
9 10
t
11
t
12
Figure 3. Pixel Port and Control Output Timing
Rev. B | Page 9 of 100
Min
t
3
t
t
4
8
ADV7181B
Typ Max Unit
45.5 °C/W
9.2 °C/W
47 °C/W
11.1 °C/W