Cleaning; Reflow Soldering Profile - We PROTEUS-III User Manual

WIRELESS CONNECTIVITY & SENSORS
User manual Proteus-III
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After reflow soldering, visually inspect the board to confirm proper alignment

18.2.2. Cleaning

Do not clean the product. Any residue cannot be easily removed by washing. Use a "no clean"
soldering paste and do not clean the board after soldering.
• Do not clean the product with water. Capillary effects can draw water into the gap between
the host PCB and the module, absorbing water underneath it. If water is trapped inside, it
may short-circuit adjoining pads. The water may also destroy the label and ink-jet printed
text on it.
• Cleaning processes using alcohol or other organic solvents may draw solder flux residues
into the housing, which won't be detected in a post-wash inspection. The solvent may also
destroy the label and ink-jet printed text on it.
• Do not use ultrasonic cleaning as it will permanently damage the part, particularly the
crystal oscillators.
Order code 2611011024000
Version 1.8 , July 2022
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Figure 33: Reflow soldering profile
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