Manufacturing Information; Moisture Sensitivity Level; Soldering; Reflow Soldering - We PROTEUS-III User Manual

WIRELESS CONNECTIVITY & SENSORS
User manual Proteus-III

18. Manufacturing information

18.1. Moisture sensitivity level

This wireless connectivity product is categorized as JEDEC Moisture Sensitivity Level 3 (MSL3),
which requires special handling.
More information regarding the MSL requirements can be found in the IPC/JEDEC J-STD-020
standard on www.jedec.org.
More information about the handling, picking, shipping and the usage of moisture/reflow and/or
process sensitive products can be found in the IPC/JEDEC J-STD-033 standard on www.jedec.org.

18.2. Soldering

18.2.1. Reflow soldering
Attention must be paid on the thickness of the solder resist between the host PCB top side
and the modules bottom side. Only lead-free assembly is recommended according to JEDEC
J-STD020.
Profile feature
Preheat temperature Min
Preheat temperature Max
Preheat time from T
Ramp-up rate (T
Liquidous temperature
Time t maintained above T
L
Peak package body temperature
Time within 5 °C of actual peak temperature
Ramp-down Rate (T
Time 20 °C to T
Table 81: Classification reflow soldering profile, Note: refer to IPC/JEDEC J-STD-020E
Order code 2611011024000
Version 1.8 , July 2022
to T
S Min S Max
to T )
L P
L
to T )
P L
P
Value
T 150 °C
S Min
T 200 °C
S Max
t 60 - 120 seconds
S
3 °C / second max.
T 217 °C
L
t 60 - 150 seconds
L
T see table below
P
t 20 - 30 seconds
P
6 °C / second max.
8 minutes max.
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