Important Information; Important Safety Instructions; Operating Considerations; Important Safety Notes - Balluff MATRIX VISION mvBlueNAOS Technical Manual

1.6 Important Information

1.6 Important Information

1.6.1 Important Safety Instructions

• We cannot and do not take any responsibility for the damage caused to you or to any other equipment
connected to a MATRIX VISION device. Similarly, warranty will be void, if a damage is caused by not following
the manual.
• Handle your MATRIX VISION device with care. Do not misuse it. Avoid shaking, striking, etc.. Your MATRIX
VISION device could be damaged by faulty handling or shortage.
• Do not use accessories not recommended by the product manufacturer as they may cause hazards.
• The product should be situated away from heat sources such as radiators, heat registers, stoves, or other
products (including amplifiers) that produce heat.
• Using the board-level version:
– Provide sufficient cooling because single components can reach high temperatures.
– Handle with care and avoid damage of electrical components by electrostatic discharge (ESD):
* Discharge body static (contact a grounded surface and maintain contact).
* Avoid all plastic, vinyl, and Styrofoam (except anti-static versions) around printed circuit boards.
* Do not touch components on the printed circuit board with your hands or with conductive devices.

1.6.2 Operating considerations

1.6.2.1 Important Safety Notes

• Handle with care and avoid damage of electrical components by electrostatic discharge (ESD):
– Discharge body static (contact a grounded surface and maintain contact).
– Avoid all plastic, vinyl, and Styrofoam (except anti-static versions) around printed circuit boards.
– Do not touch components on the printed circuit board with your hands or with conductive devices.
Be careful when bending the flex cable. The minimum bending radius is approx. 3 mm.
• Provide sufficient cooling because single components can reach high temperatures. Inadequate and incorrect
cooling invalidate the guarantee. For heat dissipation, we recommend to use a thermal conduction plate.
• Camera case temperature should not exceed 65 °C.
Attention
"Overheating"
The mainboards temperature may not exceed 80°C otherwise the device can be damaged.
MATRIX VISION GmbH
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