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2.2
Features and Specifications
Table 2-1 Features and Specifications
Item
Time to Market
Processor Type
Processor Socket
Memory
Display Controller Type
Backplane
NIC Controller
Management Chip
I/O Ports
PCIe Expansion Slots
Description
2022/03
AMD® Milan® scalable processors (1 CPU, TDP
up to 280 W)
One
Memory type: RDIMM, LRDIMM
Memory slots: 16
Total memory capacity: Up to 2 TB (128 GB
per memory module)
Integrated in the ASPEED 2500 chip, up to 1280
× 1024 resolution
Hot-swap SAS/SATA/NVMe drives
Standard OCP NIC 3.0 cards or standard PCIe
cards supported on the motherboard
Integrated with 1 independent 1000 Mbps
network port, dedicated for IPMI remote
management
2 rear USB 3.0 ports, 1 front USB 3.0 port
1 front VGA port, 1 rear VGA port
1 rear serial port
2 UID buttons and LEDs (1 front and 1
rear)
1.
3 onboard PCIe Gen 4.0 ×16 slots and 1
PCIe 4.0 ×16 slot (16 lanes) for PCIe riser
cards
2.
The riser card supports horizontal-
inserted full-height or half-height cards.
3.
3 PCIe configuration: Up to 2 riser cards
Butterfly riser is populated with a riser
card with 2 PCIe 4.0 ×16 slots.
Right 1 slot riser is populated with a
riser card with 1 PCIe 4.0 ×16 slot.
4.
2 PCIe configuration: Up to 3 riser cards
Left 1 slot riser is populated with a
riser card with 1 PCIe 4.0 ×16 slot.
Right 1 slot riser is populated with a
8
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