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PENTIUM® PRO PROCESSOR AT 150, 166, 180, and 200 MHz
8.5.
Thermal Specifications
This section describes the cooling solution utilized by
the
OverDrive
processor
requirements for both the processor and VRM. Heat
dissipation by the OverDrive processor will be no
greater than the Pentium Pro processor, as
described in Section 6 and Table 5.
®
8.5.1.
OverDrive
PROCESSOR COOLING
REQUIREMENTS
The OverDrive processor will be cooled with a
fan/heatsink
cooling
solution.
processor will operate properly when the preheat
temperature, T
, is a maximum of 50°C (T
PH
temperature of the air entering the fan/heatsink,
measured 0.3" above the center of the fan — See
Figure 48).
When
the
requirement is met, the fan/heatsink will keep the
case temperature, T
, within the specified range,
C
provided
airflow
through
unimpeded
(see
Section 8.2.2.2.).
It is strongly recommended that testing be conducted
to determine if the fan inlet temperature requirement
is met at the system maximum ambient operating
temperature.
NOTE
The OverDrive processor will operate properly
when the preheat temperature, T
maximum of 50°C (T
PH
the air entering the fan/heatsink, measured
0.3" above the center of the fan — See
Figure 48.)
8.5.1.1.
Fan/Heatsink Cooling Solution
A height of 0.4" airspace above the fan/heatsink unit
and a distance of 0.2" around all four sides of the
OverDrive processor is REQUIRED to ensure that
the airflow through the fan/heatsink is not blocked.
The fan/heatsink will reside within the boundaries of
the surface of the chip. Blocking the airflow to the
fan/heatsink reduces the cooling efficiency and
decreases fan life. Figure 48 illustrates an acceptable
airspace clearance above the fan/heatsink and
around the OverDrive processor package.
90
and
the
cooling
The
OverDrive
is the
PH
preheat
temperature
the
fan/heatsink
is
Space
Requirements,
, is a
PH
is the temperature of
8.5.2.
OEM PROCESSOR COOLING
REQUIREMENTS
The OEM processor cooling solution must not
impede the upgradability of the system. For example:
•
If an OEM fan/heatsink is used, then electrical
connections between the OEM fan/heatsink and
system must be through an end user separable
connector.
•
If an OEM fan/heatsink is used, removal of the
assembly must not interfere with the operation
of the OverDrive processor, for example, by
activating cooling failure protection mechanisms
employed by the OEM.
•
Custom attachment features in addition to the
features covered in Section 8.2.2.3. must not
interfere with attachment of the upgrade
retention clips.
OverDrive ® VRM COOLING
8.5.3.
REQUIREMENTS
The OverDrive Voltage Regulator Module will be
shipped with a passive heat sink. Voltage regulator
case temperature must not exceed 105°C. The
ambient temperature, T
, required to properly cool
A
the VRM can be estimated from the following section.
8.5.4.
THERMAL EQUATIONS AND DATA
The OverDrive Voltage Regulator Module requires
that T
does not exceed 105°C. T
C
the surface of the hottest component of the VRM. To
calculate T
values for the VRMs at different flow
A
rates, the following equations and data may be used:
T
= T
- (P
A
C
Where,
T
and T
= Ambient and Case temperature,
A
C
respectively. (°C)
Θ
=
Case-to-Ambient Thermal Resistance
CA
(°C/Watt)
P =
Maximum Power Consumption (Watt)
E
is measured on
C
Θ
Χ
)
CA
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