3.3.9.
LPC Bus ........................................................................................................................................23
3.3.10.
USB ..............................................................................................................................................23
3.3.11.
USB Root Segmentation ..............................................................................................................24
3.3.12.
SPI (BIOS only) .............................................................................................................................24
3.3.13.
Miscellaneous..............................................................................................................................25
3.3.14.
SMBus..........................................................................................................................................25
3.3.15.
I2C Bus.........................................................................................................................................25
3.3.16.
General Purpose I/O (GPIO) ........................................................................................................26
3.3.17.
Serial Interface Signals ................................................................................................................26
3.3.18.
3.3.19.
Power and Ground ......................................................................................................................27
3.4.
CD Signal Descriptions .................................................................................................. 28
3.4.1.
USB 3.0 Extension .......................................................................................................................28
3.4.2.
PCI Express x1..............................................................................................................................28
3.4.3.
DDI Channels ...............................................................................................................................29
3.4.4.
DDI to DP/HDMI Mapping...........................................................................................................31
3.4.5.
3.4.6.
Module Type Definition ..............................................................................................................33
3.4.7.
Power and Ground ......................................................................................................................33
4.
4.1.
4.1.1.
4.2.
4.3.
Status LEDs.................................................................................................................... 36
4.4.
Fan Connector............................................................................................................... 37
4.5.
4.6.
4.6.1.
Switch Locations..........................................................................................................................39
4.6.2.
4.6.3.
4.7.
5.
5.1.
5.1.1.
Voltages.......................................................................................................................................43
5.1.2.
Main Current ...............................................................................................................................43
5.1.3.
BMC Status ..................................................................................................................................43
5.1.4.
Exception Codes ..........................................................................................................................44
5.1.5.
BMC Flags....................................................................................................................................44
Express-BL
Page 5
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