Edwards iXL600 Instruction Manual page 3

In accordance with the requirements of the Chinese regulatory requirement on the Management Methods for the
Restriction of the Use of Hazardous Substances in Electrical and Electronic Products Order No. 32 (also known as
'China RoHS2') and SJ/T 11364 Marking for the Restricted Use of Hazardous Substances in Electronic and Electrical
Products:
Product
All iXL120 models
All iXL200 models
All iXL600, 600N, 600M models
All iXL1000, 1000N, 1000M models
IPUP2
Tool Interface (MicroTIM) (If Fitted)
部件名称
Part name
Lead
机壳
Enclosure
电机（泵和机械增
压泵）
Motors (pump and
mechanical
booster)
泵和增压泵
Pump and booster
电子元件和控件
Electronics and
Controls
冷却系统
Cooling system
吹扫系统
Purge system
机台接口
Tool Interface
O: 表示该有害物质在该部件的所有均质材料中的含量低于 GB/T 26572 标准规定的限量要求。
O: Indicates that the hazardous substance contained in all of the homogeneous materials for this part is
below the limit requirement in GB/T 26572.
X: 表示该有害物质在该部件的至少一种均质材料中的含量超出 GB/T26572 标准规定的限量要求。
X: Indicates that the hazardous substance contained in at least one of the homogeneous materials used for
this part is above the limit requirement of GB/T26572.
NOTE: These products are EU RoHS compliant, the following Exemptions apply:
6(b) Lead as an alloying element in aluminium containing up to 0.4% by weight
6(c) Copper alloy containing up to 4% lead by weight
7(a) Lead in in high melting temperature type solder (i.e. lead based alloys containing 85% by or more)
7(b) Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling,
transmission, and network management for telecommunications
(c) I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g.
piezoelectronic devices, or in a glass or ceramic matrix compound
7(c) II Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher
8(b) Cadmium and its compounds in electrical contacts
15 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit
flip chip packages
34 Lead in cermet-based trimmer potentiometer elements
Material Declaration
Product Labels
Materials Content Declaration
铅 汞
Mercury Cadmium
(Pb) (Hg) (Cd)
X O
X O
X O
X O
X O
X O
X O
This product contains hazardous substances in at
least one of the homogeneous materials used
which are above the limit requirement in GB/T
26572 as detailed in the declaration table below.
These parts can safely be used for the
environmental protection use period as
indicated.
材料成分声明
有害物质
Hazardous Substances
六价铬
镉
Hexavalent
Chromium
(Cr VI)
O O
O O
O O
X O
O O
O O
O O
Meaning
多溴联苯 多溴二苯醚
Polybrominated Polybrominated
biphenyls diphenyl ethers
(PBB) (PBDE)
O
O
O
O
O
O
O
P200-05-080
Issue B
O
O
O
O
O
O
O