Hardware Specification - Intrinsyc Open-Q 670 HDK User Manual

Open-Q™ 670 HDK Hardware Development Kit User Guide Version 1.0

3.7.3 Hardware Specification

Table 3.7-2 Open-Q 670 HDK Processor Board Hardware Features
Subsystem /
Connectors
Chipset SDA670
PMIC (PM670, PM670L)
Memory LPDDR4x
eMMC
UFS
Connectivity Wi-Fi 2.4 GHz/ 5GHz via
WCN3990 – Analog IQ,
WSI 2.0,
BT 2.4 GHz via WCN3990
– UART / SLIMbus
Feature Set
Qualcomm® Snapdragon™ 670
Processor
Qualcomm® PMIC, Companion PMIC
for SDA670 processor
6GB LPDDR4X
64GB eMMC5.1
128GB UFS2.1
Wi-Fi Atheros WCN3990Wi-Fi + BT
+FM Combo Chip
Wi-Fi Atheros WCN3990
Wi-Fi + BT +FM Combo Chip
Copyright Intrinsyc Technologies Corporation
Description
14
Specification
A customized 64-bit ARM
v-8 compliant applications
processor
(Qualcomm® Kryo™ CPU
360)
• Kryo Gold: dual
high-performance
cores 2.016 GHz
• Kryo Silver: hexa
low-power cores
1.708 GHz
Adreno GPU 615 up to
430 MHz
Low-power sensor over
Hexagon DSP v65
(shared with low-power
audio) 16/16/512 KB (with
LPI)
PM670 – part of the dual
PMIC solution that
integrates wireless
product's power
management, general
housekeeping, user
interface, and IC-level
interface support
functions.
PM670L – supplements
the maser core
PMIC(PM670) to integrate
all wireless handset power
management, general
housekeeping, audio
codec, and user interace
support functions into an
integrated two-IC solution,
PM670L supports the LCD
display module.
LPDDR4x up to 1866MHz
eMMC 5.1
UFS 2.1
802.11a/b/g/n/ac 2.4/5.0
GHz via WCN3990 over
analog IQ, WSI 2.0,
Support BT 5.0 + HS and
backward compatible with
BT 1.x, 2.x + EDR