Open-Q™ 670 HDK Hardware Development Kit User Guide Version 1.0
2. DOCUMENTS
This section lists the supplementary documents for the Open-Q 670 Hardware Development
Kit.
2.1 Applicable Documents
REFERENCE
A-1
Intrinsyc Purchase and Software License Agreement for the Open-Q
Development Kit
2.2 Reference Documents
REFERENCE
2.3 Terms and Acronyms
Term and acronyms
AMIC
ANC
B2B
BLSP
BT LE
CSI
DSI
EEPROM
eMMC
FCC
FWVGA
GPS
HDMI
HSIC
JTAG
LNA
MIPI
MPP
NFC
RF
SATA
SLIMBUS
SPMI
SSBI
UART
UFS
UIM
USB
USB HS
USB SS
Definition
Analog Microphone
Audio Noise Cancellation
Board to Board
Bus access manager Low Speed Peripheral (Serial interfaces like UART /
SPI / I2C/ UIM)
Bluetooth Low Energy
Camera Serial Interface
MIPI Display Serial Interface
Electrically Erasable Programmable Read only memory
Embedded Multimedia Card
US Federal Communications Commission
Full Wide Video Graphics Array
Global Positioning system
High Definition Media Interface
High Speed Inter Connect Bus
Joint Test Action Group
Low Noise Amplifier
Mobile Industry processor interface
Multi-Purpose Pin
Near Field Communication
Radio Frequency
Serial ATA
Serial Low-power Inter-chip Media Bus
System Power Management Interface (Qualcomm® PMIC / baseband
proprietary protocol)
Single wire serial bus interface (Qualcomm® proprietary mostly PMIC /
Companion chip and baseband processor protocol)
Universal Asynchronous Receiver Transmitter
Universal Flash Storage
User Identity module
Universal Serial Bus
USB High Speed
USB Super Speed
Copyright Intrinsyc Technologies Corporation
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