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Open-Q™ 845 µSOM Development Kit
User Guide
[Document: ITC-01DEV1430-UG-001 Version: 1.0]
Your use of this document is subject to and governed by those terms and conditions in the Intrinsyc Purchase an Open-Q Development Kit Based on
Snapdragon 845 Series (SDA845) Processor and Software License Agreement for the Open-Q 845 Development Kit, which you or the legal entity you
represent, as the case may be, accepted and agreed to when purchasing an Open-Q Development Kit from Intrinsyc Technologies Corporation
("Agreement"). You may use this document, which shall be considered part of the defined term "Documentation" for purposes of the Agreement, solely
in support of your permitted use of the Open-Q 845 Development Kit under the Agreement. Distribution of this document is strictly prohibited without
the express written permission of Intrinsyc Technologies Corporation and its respective licensors, which they can withhold, condition or delay in its sole
discretion.
Intrinsyc is a trademark of Intrinsyc Technologies Corporation., registered in Canada and other countries.
Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Other product and brand
names used herein may be trademarks or registered trademarks of their respective owners.
This document contains technical data that may be subject to U.S. and international export, re-export, or transfer ("export") laws. Diversion contrary to
U.S. and international law is strictly prohibited.

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Summary of Contents for Intrinsyc Open-Q 845 mSOM

  • Page 1 [Document: ITC-01DEV1430-UG-001 Version: 1.0] Your use of this document is subject to and governed by those terms and conditions in the Intrinsyc Purchase an Open-Q Development Kit Based on Snapdragon 845 Series (SDA845) Processor and Software License Agreement for the Open-Q 845 Development Kit, which you or the legal entity you represent, as the case may be, accepted and agreed to when purchasing an Open-Q Development Kit from Intrinsyc Technologies Corporation (“Agreement”).
  • Page 2 Open-Q™ 845 µSOM Development Kit User Guide Version 1.0 IDENTIFICATION Document Title Open-Q™ 845 µSOM Development Kit User Guide Document Number ITC-01DEV1430-UG-001 Version Date Oct. 7, 2019 History REVISION DATE DESCRIPTION PAGES Oct. 7, 2019 Initial Release © Copyright Intrinsyc Technologies Corporation 2 of 30...
  • Page 3: Table Of Contents

    Audio IO Expansion Header J2000 (10) ..............28 3.7.21 Audio Headset Jack J1800 (8) ................. 29 3.7.22 WLAN / BT Antenna Connections (13, 14) ............29 3.7.23 Quiet Thermistor RT800 (35) .................. 30 © Copyright Intrinsyc Technologies Corporation 3 of 30...
  • Page 4 Table 13. Audio Inputs Expansion Header Pinout J1900 ..............27 Table 14. Audio Outputs Expansion Header Pinout J1901..............28 Table 15. Audio IO Expansion Header Pinout J2000 ................28 Table 16. Haptic Output Header Pinout J802 ..................30 © Copyright Intrinsyc Technologies Corporation 4 of 30...
  • Page 5: Introduction

    1.1 Purpose The purpose of this user guide is to provide instructions and technical information on the Open-Q 845 µSOM Development Kit. You can find information on this and other Intrinsyc development kits on the Intrinsyc web site: https://www.intrinsyc.com/development-kits/ 1.2 Scope This document will cover the following items on the Open-Q 845 µSOM Development Kit:...
  • Page 6: Documents

    2.1 Applicable Documents REFERENCE TITLE Intrinsyc Purchase and Software License Agreement for the Open-Q Development 2.2 Reference Documents The below listed documents are available on the Intrinsyc Technical Portal: https://tech.intrinsyc.com (dev kit registration required). REFERENCE TITLE Open-Q 845 µSOM HW Device Specification Open-Q 845 µSOM –...
  • Page 7 PMIC / Companion chip and baseband processor protocol) UART Universal Asynchronous Receiver Transmitter Universal Flash Storage User Identity module Universal Serial Bus USB HS USB High Speed USB SS USB Super Speed © Copyright Intrinsyc Technologies Corporation 7 of 30...
  • Page 8: Open-Q 845 Μsom Development Kit

    The Open-Q 845 µSOM Development Kit comes with Android software pre-programmed and includes the following: o Open-Q 845 µSOM with the Snapdragon 845 (SDA845) processor o Mini-ITX form-factor carrier board o AC power adapter © Copyright Intrinsyc Technologies Corporation 8 of 30...
  • Page 9: Important Locations

    Open-Q™ 845 µSOM Development Kit User Guide Version 1.0 3.4.1 Important Locations The diagram below shows the locations of key components, interfaces, and controls. Figure 1. Assembled Open-Q 845 µSOM Development Kit © Copyright Intrinsyc Technologies Corporation 9 of 30...
  • Page 10: Table 1. List Of Development Kit Features Itemized In The Figure Above

    SOM Current Sense Probe Header J301 LEDs: (Charge State / Power / Blue / Green / Red) DS2503 / DS2504 / DS2500 / DS2501 / DS2502 System Configuration DIP Switch S2600 Open-Q LCD Panel © Copyright Intrinsyc Technologies Corporation 10 of 30...
  • Page 11: Block Diagram

    C / GPIO Switches UART Sensor Header ST Micro V6 Sensor Brd FTDI Debug UART UART Serial USB microUSB Open-Q 845 µSOM Development Board Figure 2. Open-Q 845 µSOM Dev Kit Block Diagram © Copyright Intrinsyc Technologies Corporation 11 of 30...
  • Page 12: Optional Accessories

    3.4.3 Optional Accessories Optional accessories are available for the Open-Q 845 µSOM Development Kit, like LCD Panel, Camera adapter, and sensor board. Please visit the Intrinsyc product store for availability of these accessories: https://shop.intrinsyc.com/collections/all, or contact sales@intrinsyc.com. © Copyright Intrinsyc Technologies Corporation...
  • Page 13: Getting Started

    This section explains how to setup the Open-Q 845 µSOM Development Kit and start using it. 3.5.1 Registration To register the development kit and gain access to the Intrinsyc Technical Document Portal, please visit: http://tech.intrinsyc.com/account/register. To proceed with registration, the development kit serial number is required. These serial numbers can be found on the labels that are present on the SOM and carrier boards.
  • Page 14: Open-Q 845 Μsom

    Various audio I/O functions Differential Input Haptic motor header Haptic device driver LRM and ERA capable Haptic motor output driver Micro SD (on bottom) Micro SD card 4bit Micro SD card support External Storage © Copyright Intrinsyc Technologies Corporation 14 of 30...
  • Page 15: Som Board To Board Connectors (33)

    There is a DIP switch S2600 on the top side of the Open-Q 845 carrier board. The 8-bit switch allows the user to control the system configuration and boot options. The image below shows the DIP switch assignments. © Copyright Intrinsyc Technologies Corporation 15 of 30...
  • Page 16: Input Power Selection

    See the table below for a description of the DIP switch connections. Table 3 - Boot Configuration DIP Switch Settings Function Description Notes Switch For factory mode programming. Connected For Intrinsyc use only. Leave open / FORCED_USB_BOOT S2600-1 to CPU GPIO57. OFF. Enables WATCHDOG_DISABLE when Unsupported feature. Leave switch open /...
  • Page 17: Figure 4. Input Power Selection Locations

    For battery powered dev kit, set switch to connector J300. open / OFF if thermistor is included on the battery pack. Otherwise keep switch closed / ON. © Copyright Intrinsyc Technologies Corporation 17 of 30...
  • Page 18: Som Current Sense Header J301 (35)

    The SOM Current Sense header, J301, can be used to monitor the SOM’s current consumption on the main SOM_SYS_PWR power rail. A close up of the J301 (PWR PROBE) location is shown below. © Copyright Intrinsyc Technologies Corporation 18 of 30...
  • Page 19: Coin Cell Battery Holder B300 (30)

    It is recommended that the Panasonic ML621 series rechargeable coin cell be used (not supplied with the development kit). See item 30 in Figure 1 for the coin cell battery holder location on the 845 carrier board. © Copyright Intrinsyc Technologies Corporation 19 of 30...
  • Page 20: Power Header J700 (36)

    There are four user buttons and four LED’s on the Open-Q 845 µSOM Development Kit as described in the tables below. See items 7 and 36 in Figure 1 for the carrier board locations of the user buttons and LEDs, respectively. © Copyright Intrinsyc Technologies Corporation 20 of 30...
  • Page 21: Debug Serial Uart Over Usb J1600 (12)

    Mini-PCIe USB enable DIP switch S2401 (6) must be switched to closed / ON (figure below). If the DIP switch is closed, the USB 3.1 Type A connector is not functional. © Copyright Intrinsyc Technologies Corporation 21 of 30...
  • Page 22: Micro Sd Card Socket J1500 (22)

    Display Module (see figure below). The SD interface supports High Speed mode. Figure 7. Micro SD Card Socket J1500 © Copyright Intrinsyc Technologies Corporation 22 of 30...
  • Page 23: Display Connector J1400 (38)

    3.7.12 Display Connector J1400 (38) The 100-pin display connector, J1400, allows for an optional display adapter to be connected to the development kit. Intrinsyc offers a compatible LCD panel accessory for the Open-Q 845 µSOM Development Kit. It can be purchased here: https://shop.intrinsyc.com/products/open-q-810-820-lcd.
  • Page 24: Camera Connectors J1000 (15), J1100 (16), J1200 (17), J1300 (18)

    J1200, and J1300 allowing users to connect multiple camera adapters to the development kit. See items 15 through 18 in Figure 1 for the carrier board locations of the camera connectors. Intrinsyc offers compatible camera module accessories for the Open-Q 845 µSOM Development Kit here: https://shop.intrinsyc.com/collections/accessories.
  • Page 25: Mini-Pcie Card Connector J2801 (24)

    PCI Express mini card standards. Please refer to the document at the following link for more information: https://www.pcisig.com/specifications/pciexpress/base/#mini1.2 The optional SIM card socket J2800 (25) can be used if the user is connecting a mini-PCIe card with cellular connection capabilities. © Copyright Intrinsyc Technologies Corporation 25 of 30...
  • Page 26: Digital Io Expansion Header J2200 (23)

    Table 12 - Sensor Expansion Header J2100 Pinout Signal Description Signal Description CPU Sensor Core SSC0_QUP0_0_I2C1_SDA GPIO117_ACCEL_INT CPU GPIO117 SSC_GPIO0 CPU Sensor Core SSC1_QUP0_1_I2C1_SCL GPIO123 CPU GPIO123 SSC_GPIO1 GPIO63_QUA_MI2S_DATA CPU GPIO63 GPIO118_GYRO_INT CPU GPIO118 © Copyright Intrinsyc Technologies Corporation 26 of 30...
  • Page 27: Audio Inputs Expansion Header J1900 (27)

    WCD9340 for the user. See item 26 in Figure 1 for the carrier board location of this header. The pinout for this header is shown in the table below. © Copyright Intrinsyc Technologies Corporation 27 of 30...
  • Page 28: Audio Io Expansion Header J2000 (10)

    QUA_MI2S_DATA3 CPU GPIO64 – can be configured GPIO64_CO Ground as PRI_MI2S_MCLK (see Note 1 DEC_RST_N below) GPIO65_CODEC_S CPU GPIO65 – can be configured as Ground PI_MISO PRI_MI2S_SCK (see Note 1 below) © Copyright Intrinsyc Technologies Corporation 28 of 30...
  • Page 29: Audio Headset Jack J1800 (8)

    3.7.22 WLAN / BT Antenna Connections (13, 14) The Open-Q 845 µSOM Development Kit WLAN/BT functionality is based on Qualcomm WCN3990 chipset. It provides WLAN/Bluetooth in 2x2 MIMO with two spatial streams © Copyright Intrinsyc Technologies Corporation 29 of 30...
  • Page 30: Quiet Thermistor Rt800 (35)

    See item 9 in Figure 1 for the carrier board location of this header. The pinout for this header is shown in the table below. Table 16. Haptic Output Header Pinout J802 Pin No Signal Description HAP_OUT_R_P Haptic output positive HAP_OUT_R_N Haptic output negative © Copyright Intrinsyc Technologies Corporation 30 of 30...

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