Siemens SINAMICS G130 Engineering Manual page 142

EMC Installation Guideline
Engineering Information
The following diagram illustrates all grounding and high-frequency equipotential bonding measures using the
example of a typical installation comprising several SINAMICS S120 Cabinet Modules.
Grounding and high-frequency equipotential bonding measures in the drive system and in the plant
The ground connections shown in black [0] represent the conventional grounding system for the drive components.
They are made with standard, heavy-power PE conductors without special high-frequency properties and ensure low
frequency equipotential bonding as well as protection against injury.
The connections shown in red inside the SINAMICS cabinets [1] provide solid bonding for high-frequency currents
between the metal housings of the integrated chassis components and the PE busbar and the EMC shield busbar of
the cabinet. These internal connections can be made via a large area using non-isolated metal construction
components of the cabinet. In this case, the contact surface must be bare metal and each contact area must have a
minimum cross-section of several cm
braided copper wires with a large cross-section ( ≥ 95 mm
The shields of the motor cables shown in orange [2] provide high-frequency equipotential bonding between the Motor
Modules and the motor terminal boxes. The finely stranded, braided copper cables shown in red can be routed in
parallel with the cable shields when cables with poor high-frequency properties are used or in installations with bad
grounding systems.
The connections shown in red [3], [4] and [5] provide a solid, high-frequency bonding between the motor housing and
the motor terminal box or the gearbox and the driven machine.
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2
. Alternatively, these connections can be made with short, finely stranded,
2
).