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7 Specifications
Physical Characteristics
Dimensions
Insertion/extraction Cycles TBD min
Environmental
Operating Temperature
Storage Temperature
Cooling
Vibration
Shock
Humidity
Altitude
Conformal Coating
Electrical
Power Supply Voltage
Mechanical
MTBF
FIT
Standards
Board/module
Shock and Vibration
Regulatory
Specifications
For public disclosure
Note Refer to PICMG COM.0 R2.1 COM Express Module Base Specification located at
www.picmg.org.
mCOM10-L1500 Specifications
Height: 55 ±0.25 mm (2.17 ±0.01 in)
Width: 84 ±0.25 mm (3.31 ±0.01 in)
Module thickness: 13 ±0.65 mm (0.512 ±0.03 in), measured from bottom side of circuit board to
top surface of heat spreader
Maximum component height: 3.8 mm (0.15 in) (primary side), 3.8 mm (0.15 in) (secondary side)
Standard: 0 to 65°C (32 to 149 °F)
Extended: –40 to 85°C (–40 to 185 °F)
–50 to 100°C (–58 to 212 °F)
Convection: Level A, F
Conduction: Level D
Random, 0.1g
2
/Hz from 15 to 2000 Hz
40g pk saw tooth, 11 ms duration
10 to 90% RH, non-condensing
Up to 4,572 m (15,000 ft) above sea level
Coating thickness ~ 0.0508 to 0.0762 mm (0.002 to 0.003 in)
V
: 3 V nominal ; 2.0 to 3.3
RTC
V
: 5 V nominal; 4.75 to 5.25
5VSBY
V
: 12 V nominal; 4.75 to 20 (wide input range), ≥ V
12V
TBD hours at the 50°C (122 °F) ground
TBD
RoHS Directive
IPC-A-610 Class 2 rules
UL 60950-1 Safety and FCC 47 CFR Part 15, Class A certificates
CE mark (when installed in compliant carrier and enclosure)
ANSI/VITA47-2005
EMC: designed to meet CE, FCC Class A and B
– 0.1 V
5VSBY
GFK-2896 Hardware Reference Manual 73
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