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4
Retention Assembly Mechanical
Design
4.1
Mechanical Retention Assembly
Unlike previous Intel processors that use an integrated loading mechanism or ILM, the
processor is designed to work with a spring-loading mechanism to provide retention to
the main board and the heatsink. Refer to
details.
The main components of the socket stack for the processor are:
• Backplate
• Bolster plate with spring
• Processor package clip or carrier
• Heatsink
4.1.1
Backplate
The backplate provides structural rigidity to the entire heatsink and processor package
retention on the topside of the main board, and helps ensure long-term solder joint
reliability. It is 2.2 mm thick and made of carbon-steel material. There are cutouts for
component placements on the backside of the main board or socket. The backplate has
a total of seven holes for threaded bolts to attach it to the bolster plate on the opposite
side of the main board. The number and location of the holes is determined through
structural analysis. Between the metal backplate and the main board lies an insulator
to isolate the backplate from the routing and vias on the backside of the main board.
The total thickness of the backplate and insulator is 2.5 mm.
Figure 4-1.
Backplate and Insulator with Mounting Screws
Pin A1
Alignment
Mark
®
®
Intel
Xeon
Phi™ Processor x200 Product Family TMSDG
32
Retention Assembly Mechanical Design
Appendix E
for specific mechanical design
Insulator
Back Plate
7 Bolts
Order Number: 334785-002
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