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Independent Loading Mechanism (ILM) and Back Plate
3
Independent Loading
Mechanism (ILM) and Back
Plate
The Independent Loading Mechanism (ILM) provides the force needed to seat the
1356-LGA land package onto the socket contacts. The ILM is physically separate from
the socket body. The assembly of the ILM to the board is expected to occur after wave
solder. The exact assembly location is dependent on manufacturing preference and test
flow.
Note:
The ILM has two critical functions: deliver the force to seat the processor onto the
socket contacts and distribute the resulting compressive load evenly through the socket
solder joints.
Note:
The mechanical design of the ILM is a key contributor to the overall functionality of the
LGA1356 socket. Intel performs detailed studies on integration of processor package,
socket and ILM as a system. These studies directly impact the design of the ILM. The
Intel reference ILM will be "build to print" from Intel controlled drawings. Intel
recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not
benefit from Intel's detailed studies and may not incorporate critical design
parameters.
3.1
Design Concept
The ILM and back plate are assemblies and can be procured from the enabled vendors.
3.1.1
ILM Assembly Design Overview
The ILM assembly consists of four major pieces: load lever, load plate, frame and the
captive fasteners.
The load lever and load plate are stainless steel. The frame and fasteners are high
carbon steel with appropriate plating. The fasteners are fabricated from a high carbon
steel. The frame provides the hinge locations for the load lever and load plate.
The ILM assembly design ensures that once assembled to the back plate and the load
lever is closed, the only features touching the board are the captive fasteners. The
nominal gap of the frame to the board is ~1 mm when the load plate is closed on the
empty socket or when closed on the processor package.
When closed, the load plate applies two point loads onto the IHS at the "dimpled"
features shown in
transmitted to the frame and through the captive fasteners to the back plate. Some of
the load is passed through the socket body to the board inducing a slight compression
on the solder joints.
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
Figure
3-1. The reaction force from closing the load plate is
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