Package Critical-To-Function Attributes; Other Processor Package Specific Design Attributes; Processor With Fabric Package Features And Design Attributes - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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Processor Mechanical Design
2.3.1

Package Critical-to-Function Attributes

The processor package land dimension details, base material, plating material and
plating thickness are provided in
to-Function (CTF) attributes. CTF values are detailed on the processor package
drawings in
• Package Alignment Length
• Package Alignment Width
• Package Substrate Thickness
• Land Length
• Land Width
• Land True Position (Pattern Relating)
• Land Co-planarity
• Substrate Flatness
2.3.2

Other Processor Package Specific Design Attributes

Refer to
parallelism, and tilt. Key package features and design attributes are enumerated below
in Figure
• Package Product ID socket keying notch
• Package PHM alignment keying notch
• Package Pin 1 Indicator (shown in
Figure 2-4.

Processor with Fabric Package Features and Design Attributes

Order Number: 334785-002
Appendix C:
Table C-1 for additional information on package markings, KOZs, tolerances,
2-4, these include:
Appendix C. The following is a list of package Critical-
Figure 2-5 and Figure
® ®
Intel Xeon Phi™ Processor x200 Product Family TMSDG
2-6)
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