Processor Mechanical Load Specification; Processor Insertion Specification; Processor Handling Guidelines; Processor With Fabric Top And Bottom View - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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Processor Mechanical Design
Figure 2-6.

Processor with Fabric Top and Bottom View

2.7

Processor Mechanical Load Specification

Refer to
2.8

Processor Insertion Specification

Socket Insertion Cycling:
• The processor can be inserted into and removed from an LGA3647-1 socket 30
times.
IFP Cable Attachment Cycling (processor with fabric only):
• Mating and unmating of the processor package and the Linear Edge Connector
(LEC54A) on the Intel Fabric Passive (IFP) cable limit is 15 cycles.
2.9

Processor Handling Guidelines

The processor package may contain components on the top or bottom side of the
package substrate. To remove the processor from its shipping container or the tray,
grab and hold the processor along its long edges.
Avoid contacting the processor bottom side lands and/or gold fingers, and always use
Electrostatic Discharge (ESD) protective procedures and equipment.
Order Number: 334785-002
Section 3 and Section 4 for the mechanical loading specifications.
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Intel Xeon Phi™ Processor x200 Product Family TMSDG
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