Related Manuals for Intel BX80616I3540
Summary of Contents for Intel BX80616I3540
- Page 1 Intel® Xeon® Processor 3500 Series Thermal / Mechanical Design Guide March 2009 321461-001 Document Number:...
- Page 2 Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, the Intel logo, Intel, Pentium, Core and Core Inside are trademarks of Intel Corporation in the U.S. and other countries.
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Page 3: Table Of Contents
Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL ... 37 ATX Reference Thermal Solution................39 Operating Environment ..................39 Heatsink Thermal Solution Assembly..............40 ® Geometric Envelope for the Intel Reference ATX Thermal Mechanical Design ... 41 Reference Design Components ................42 Thermal and Mechanical Design Guide... - Page 4 6.4.1 Extrusion ....................42 6.4.2 Clip.......................43 6.4.3 Core .....................44 Mechanical Interface to the Reference Attach Mechanism ........44 Heatsink Mass and Center of Gravity ..............46 Thermal Interface Material ..................46 Absolute Processor Temperature ................46 Thermal Solution Quality and Reliability Requirements ..........47 Reference Heatsink Thermal Verification ...............47 Mechanical Environmental Testing................47 7.2.1 Recommended Test Sequence ..............47...
- Page 5 B-6 Reference Design Heatsink Assembly (2 of 2) ............. 57 B-7 Reference Fastener Sheet 1 of 4 ................58 B-8 Reference Fastener Sheet 2 of 4 ................59 B-9 Reference Fastener Sheet 3 of 4 ................60 B-10 Reference Fastener Sheet 4 of 4 ................61 B-11 Reference Clip - Sheet 1 of 2..................
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Page 6: Revision History
Revision History Revision Description Revision Date Number -001 • Initial release March 2009 § Thermal and Mechanical Design Guide... -
Page 7: Introduction
This document provides guidelines for the design of thermal and mechanical solutions for the: • Intel® Xeon® Processor 3500 Series Unless specifically required for clarity, this document will use “processor” in place of the specific product names. The components described in this document include: •... -
Page 8: References
The processor mates with the system board through this surface mount, 1366-contact socket. PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices. Case-to-ambient thermal characterization parameter (psi). A measure of thermal Ψ... - Page 9 Introduction Table 1-2. Terms and Descriptions (Sheet 2 of 2) Term Description Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate. Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature.
- Page 10 Introduction Thermal/Mechanical Design Guide...
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Page 11: Lga1366 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for Intel® Xeon® Processor 3500 Series. The socket provides I/O, power and ground contacts. The socket contains 1366 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard. -
Page 12: Lga1366 Socket Contact Numbering (Top View Of Socket)
LGA1366 Socket Figure 2-2. LGA1366 Socket Contact Numbering (Top View of Socket) Thermal/Mechanical Design Guide... -
Page 13: Board Layout
LGA1366 Socket Board Layout The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size is 18 mils. Note that there is no round-off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) as these values are equivalent. Figure 2-3. -
Page 14: Attachment To Motherboard
LGA1366 Socket Attachment to Motherboard The socket is attached to the motherboard by 1366 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket. As indicated in Figure 2-4, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process. -
Page 15: Contacts
LGA1366 Socket 2.3.3 Contacts Base material for the contacts is high strength copper alloy. For the area on socket contacts where processor lands will mate, there is a 0.381 μm [15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel underplate. -
Page 16: Package Installation / Removal
LGA1366 Socket Package Installation / Removal As indicated in Figure 2-6, access is provided to facilitate manual installation and removal of the package. To assist in package orientation and alignment with the socket: • The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for proper orientation. -
Page 17: Durability
LGA1366 Socket Durability The socket must withstand 30 cycles of processor insertion and removal. The max chain contact resistance from Table 4-4 must be met when mated in the 1st and 30th cycles. The socket Pick and Place cover must withstand 15 cycles of insertion and removal. Markings There are three markings on the socket: •... -
Page 18: Lga1366 Socket Nctf Solder Joints
LGA1366 Socket LGA1366 Socket NCTF Solder Joints Intel has defined selected solder joints of the socket as non-critical to function (NCTF) for post environmental testing. The processor signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. -
Page 19: Independent Loading Mechanism (Ilm)
Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM. -
Page 20: Ilm Back Plate Design Overview
Independent Loading Mechanism (ILM) Figure 3-1. ILM Cover Assembly Load Lever Load Lever Captive Fastener (4x) Captive Fastener (4x) Load Plate Load Plate Frame Frame 3.1.2 ILM Back Plate Design Overview The back plate for single processor workstation products consists of a flat steel back plate with threaded studs for ILM attach. -
Page 21: Ilm Assembly
Independent Loading Mechanism (ILM) Figure 3-2. ILM Assembly Socket Body Reflowed on board Socket Body Reflowed on board Socket Body with Back Plate on board Socket Body with Back Plate on board Step 1 Step 1 Step 2 Step 2 Thermal/Mechanical Design Guide... -
Page 22: Pin1 And Ilm Lever
Independent Loading Mechanism (ILM) As indicated in Figure 3-3, socket protrusion and ILM key features prevent 180-degree rotation of ILM cover assembly with respect to the socket. The result is a specific Pin 1 orientation with respect to the ILM lever. Figure 3-3. -
Page 23: Lga1366 Socket And Ilm Electrical, Mechanical, And Environmental Specifications
The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance. To ensure socket long term reliability, Intel defines socket maximum temperature using a via on the underside of the motherboard. Exceeding the... -
Page 24: Loading Specifications
This is the minimum and maximum static force that can be applied by the heatsink and it’s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits. -
Page 25: Environmental Requirements
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications Table 4-4. Electrical Requirements for LGA1366 Socket Parameter Value Comment Mated loop inductance, Loop The inductance calculated for two contacts, considering one forward conductor and one return <3.9nH conductor. These values must be satisfied at the worst-case height of the socket. -
Page 26: Flow Chart Of Knowledge-Based Reliability Evaluation Methodology
Freeze stressing Perform stressing to requirements and perform validate accelerated additional data turns stressing assumptions and determine acceleration factors A detailed description of this methodology can be found at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf. § Thermal/Mechanical Design Guide... -
Page 27: Sensor Based Thermal Specification Design Guidance
Sensor Based Thermal Specification Design Guidance Sensor Based Thermal Specification Design Guidance The introduction of the sensor based thermal specification presents opportunities for the system designer to optimize the acoustics and simplify thermal validation. The sensor based specification utilizes the Digital Thermal Sensor information accessed using the PECI interface. -
Page 28: Sensor Based Thermal Specification
Sensor Based Thermal Specification Design Guidance Figure 5-1. Comparison of Case Temperature vs. Sensor Based Specification Ta = 43.2 C Ta = 43.2 C Tcontrol Tcontrol Ta = 30 C Ta = 30 C Ψ-ca = 0.292 Ψ-ca = 0.292 Power Power Current Specification (Case Temp) -
Page 29: Specification When Dts Value Is Greater Than Tcontrol
Sensor Based Thermal Specification Design Guidance As in previous product specifications, a knowledge of the system boundary conditions is necessary to perform the heatsink validation. Section 5.3.1 will provide more detail on defining the boundary conditions. The TTV is placed in the socket and powered to the recommended value to simulate the TDP condition. -
Page 30: Thermal Solution Design Process
Sensor Based Thermal Specification Design Guidance Figure 5-3. Thermal solution Performance Thermal Solution Design Process Thermal solution design guidance for this specification is the same as with previous products. The initial design must take into account the target market and overall product requirements for the system. -
Page 31: Thermal Design And Modelling
There are cost and acoustic trade-offs the customer must make. To aide in the design process Intel provides TTV thermal models. Please consult your Intel Field Sales Engineer for these tools. -
Page 32: Thermal Solution Validation
Sensor Based Thermal Specification Design Guidance 5.3.3 Thermal Solution Validation 5.3.3.1 Test for Compliance to the TTV Thermal Profile This step is the same as previously suggested for prior products. The thermal solution is mounted on a test fixture with the TTV and tested at the following conditions: •... -
Page 33: Fan Speed Control (Fsc) Design Process
Sensor Based Thermal Specification Design Guidance Figure 5-5. Thermal Solution Performance vs. Fan Speed 0.50 0.40 0.30 0.20 0.10 0.00 1100 1600 2100 2600 3100 3600 Psi-ca System (BA) Note: This data is taken from the validation of the RCBF5 reference processor thermal solution. -
Page 34: Fan Speed Control Algorithm Without Tambient Data
. For simplicity, the graph shows a linear CONTROL acceleration of the fans from T – 10 to T as has been Intel’s guidance CONTROL CONTROL for simple fan speed control algorithms. As the processor workload continues to increase, the DTS value will increase and the FSC algorithm will linearly increase the fan speed from the 2500 RPM at DTS = -20 to full speed at DTS value = -1. -
Page 35: Fan Speed Control Algorithm With Tambient Data
For simplicity, the graph shows a linear acceleration of the fans from T CONTROL as has been Intel’s guidance for simple fan speed control algorithms. CONTROL As the processor workload continues to increase, the DTS value will increase and the FSC algorithm will linearly increase the fan speed from the 1450 RPM at DTS = -20 to 2250 RPM at DTS value = -1. -
Page 36: System Validation
Sensor Based Thermal Specification Design Guidance System Validation System validation should focus on ensuring the fan speed control algorithm is responding appropriately to the DTS values and T data as well as any other AMBIENT device being monitored for thermal compliance. Since the processor thermal solution has already been validated using the TTV to the thermal specifications at the predicted T , additional TTV based testing in the... -
Page 37: Specification For Operation Where Digital Thermal Sensor Exceeds Tcontrol
Sensor Based Thermal Specification Design Guidance Specification for Operation Where Digital Thermal Sensor Exceeds T CONTROL Table 5-1 is provided as reference for the development of thermal solutions and the fan speed control algorithm. Table 5-1. Thermal Solution Performance above T CONTROL Ψ... - Page 38 Sensor Based Thermal Specification Design Guidance Thermal/Mechanical Design Guide...
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Page 39: Atx Reference Thermal Solution
Intel. The design strategy is to use the design concepts from the prior Intel® Radial Curved Bifurcated Fin Heatsink Reference Design (Intel® RCBFH Reference Design) designed originally for the Intel®... -
Page 40: Heatsink Thermal Solution Assembly
The reference thermal solution for the processor is an active fan solution similar to the prior designs for the Intel® Pentium® 4 and Intel® Core™2 Duo processors. The design uses a copper core with an aluminum extrusion. It attaches to the motherboard with a fastener design reused from the RCBFH3 and RCFH4. -
Page 41: Geometric Envelope For The Intel ® Reference Atx Thermal Mechanical Design
ATX Reference Thermal Solution ® Geometric Envelope for the Intel Reference ATX Thermal Mechanical Design Figure 6-2 shows a 3-D representation of the board component keep out for the reference ATX thermal solution. A fully dimensioned drawing of the keepout information... -
Page 42: Reference Design Components
ATX Reference Thermal Solution Reference Design Components 6.4.1 Extrusion The aluminum extrusion is a 51 fin 102 mm diameter bifurcated fin design. The overall height of the extrusion is 38 mm tall. To facilitate reuse of the core design the center cylinder ID and wall thickness are the same as RCFH4. -
Page 43: Clip
[1489 lb/in]. The nominal preload provided by the reference design is 191 N ± 42 N [43 lb ± ~10 lb]. Note: Intel reserves the right to make changes and modifications to the design as necessary to the Intel RCBF5 reference design, in particular the clip. Figure 6-4. -
Page 44: Core
RCFH4. The machined flange height has been reduced from the RCFH4 design to match the IHS height for the Intel® Xeon® Processor 3500 Series when installed in the LGA1366 socket. The final height of the flange will be an output of the design validation and could be varied to adjust the preload. -
Page 45: Clip Core And Extrusion Assembly
ATX Reference Thermal Solution Figure 6-6. Clip Core and Extrusion Assembly Clip Core shoulder Core shoulder traps clip in place traps clip in place Figure 6-7. Critical Parameters for Interface to the Reference Clip Fin Array Fin Array Core Core See Detail A See Detail A Clip... -
Page 46: Heatsink Mass And Center Of Gravity
Absolute Processor Temperature Intel does not test any third party software that reports absolute processor temperature. As such, Intel cannot recommend the use of software that claims this capability. Since there is part-to-part variation in the TCC (thermal control circuit) activation temperature, use of software that reports absolute temperature can be misleading. -
Page 47: Thermal Solution Quality And Reliability Requirements
Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. The Intel reference thermal solution will be evaluated to the boundary conditions in Table 7-1. -
Page 48: Post-Test Pass Criteria
• All enabling components, including socket and thermal solution parts. The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Intel PC Diags is an example of software that can be utilized for this test. -
Page 49: A Component Suppliers
The part numbers listed below identifies the reference components. End-users are responsible for the verification of the Intel enabled component offerings with the supplier. These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. - Page 50 Component Suppliers Thermal/Mechanical Design Guide...
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Page 51: B Mechanical Drawings
Mechanical Drawings Mechanical Drawings Table B-1 lists the mechanical drawings included in this appendix. Table B-1. Mechanical Drawing List Drawing Description Figure Number “Socket / Heatsink / ILM Keepout Zone Primary Side (Top)” Figure B-1 “Socket / Heatsink / ILM Keepout Zone Secondary Side (Bottom)” Figure B-2 “Socket / Processor / ILM Keepout Zone Primary Side (Top)”... -
Page 52: Socket / Heatsink / Ilm Keepout Zone Primary Side (Top)
Mechanical Drawings Figure B-1. Socket / Heatsink / ILM Keepout Zone Primary Side (Top) 52.00 49.55 45.50 43.51 41.06 38.92 38.20 32.28 29.64 27.31 30.60 21.51 19.51 9.40 0.00 5.40 9.40 10.50 18.23 19.51 30.60 37.00 29.64 35.62 32.28 38.92 38.92 40.21 41.06... -
Page 53: Socket / Heatsink / Ilm Keepout Zone Secondary Side (Bottom)
Mechanical Drawings Figure B-2. Socket / Heatsink / ILM Keepout Zone Secondary Side (Bottom) 36.10 0.00 36.10 Thermal/Mechanical Design Guide... -
Page 54: Socket / Processor / Ilm Keepout Zone Primary Side (Top)
Mechanical Drawings Figure B-3. Socket / Processor / ILM Keepout Zone Primary Side (Top) Thermal/Mechanical Design Guide... -
Page 55: Socket / Processor / Ilm Keepout Zone Secondary Side (Bottom)
Mechanical Drawings Figure B-4. Socket / Processor / ILM Keepout Zone Secondary Side (Bottom) Thermal/Mechanical Design Guide... -
Page 56: Reference Design Heatsink Assembly (1 Of 2)
Mechanical Drawings Figure B-5. Reference Design Heatsink Assembly (1 of 2) Thermal/Mechanical Design Guide... -
Page 57: B-6 Reference Design Heatsink Assembly (2 Of 2)
Mechanical Drawings Figure B-6. Reference Design Heatsink Assembly (2 of 2) Thermal/Mechanical Design Guide... -
Page 58: B-7 Reference Fastener Sheet 1 Of 4
Mechanical Drawings Figure B-7. Reference Fastener Sheet 1 of 4 Thermal/Mechanical Design Guide... -
Page 59: B-8 Reference Fastener Sheet 2 Of 4
Mechanical Drawings Figure B-8. Reference Fastener Sheet 2 of 4 Thermal/Mechanical Design Guide... -
Page 60: B-9 Reference Fastener Sheet 3 Of 4
Mechanical Drawings Figure B-9. Reference Fastener Sheet 3 of 4 Thermal/Mechanical Design Guide... -
Page 61: B-10 Reference Fastener Sheet 4 Of 4
Mechanical Drawings Figure B-10. Reference Fastener Sheet 4 of 4 Thermal/Mechanical Design Guide... -
Page 62: B-11 Reference Clip - Sheet 1 Of 2
Mechanical Drawings Figure B-11. Reference Clip - Sheet 1 of 2 Thermal/Mechanical Design Guide... -
Page 63: B-12 Reference Clip - Sheet 2 Of 2
Mechanical Drawings Figure B-12. Reference Clip - Sheet 2 of 2 § Thermal/Mechanical Design Guide... - Page 64 Mechanical Drawings Thermal/Mechanical Design Guide...
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Page 65: C Socket Mechanical Drawings
Socket Mechanical Drawings Socket Mechanical Drawings Table C-1 lists the mechanical drawings included in this appendix. Table C-1. Mechanical Drawing List Drawing Description Figure Number “Socket Mechanical Drawing (Sheet 1 of 4)” Figure C-1 “Socket Mechanical Drawing (Sheet 2 of 4)” Figure C-2 “Socket Mechanical Drawing (Sheet 3 of 4)”... -
Page 66: Socket Mechanical Drawing (Sheet 1 Of 4)
Socket Mechanical Drawings Figure C-1. Socket Mechanical Drawing (Sheet 1 of 4) Thermal/Mechanical Design Guide... -
Page 67: Socket Mechanical Drawing (Sheet 2 Of 4)
Socket Mechanical Drawings Figure C-2. Socket Mechanical Drawing (Sheet 2 of 4) Thermal/Mechanical Design Guide... -
Page 68: Socket Mechanical Drawing (Sheet 3 Of 4)
Socket Mechanical Drawings Figure C-3. Socket Mechanical Drawing (Sheet 3 of 4) Thermal/Mechanical Design Guide... -
Page 69: Socket Mechanical Drawing (Sheet 4 Of 4)
Socket Mechanical Drawings Figure C-4. Socket Mechanical Drawing (Sheet 4 of 4) § Thermal/Mechanical Design Guide... - Page 70 Socket Mechanical Drawings Thermal/Mechanical Design Guide...
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Page 71: D Processor Installation Tool
Processor Installation Tool Processor Installation Tool The following optional tool is designed to provide mechanical assistance during processor installation and removal. Contact the supplier for availability: Billy Hsieh billy.hsieh@tycoelectronics.com +81 44 844 8292 Thermal/Mechanical Design Guide... -
Page 72: Processor Installation Tool
Processor Installation Tool Figure D-1. Processor Installation Tool § Thermal/Mechanical Design Guide...
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