Download Print this page

Processor Heatsink Module Backplate Keep-Out Zone - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

Table of Contents



Mechanical KOZs

Figure F-3.

Processor Heatsink Module Backplate Keep-Out Zone

Intel

Xeon

Phi™ Processor x200 Product Family TMSDG

Order Number: 334785-002

114

Table of Contents

Do you have a question about the Xeon Phi Processor x200 and is the answer not in the manual?