Retention Assembly Mechanical Drawings; Bolster Plate Assembly, 1/2; Bolster Plate Assembly, 2/2; Heatsink Module Clip (Non-Fabric), 1/2 - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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Retention Assembly Mechanical Drawings

E Retention Assembly
Mechanical Drawings
Table E-1
Table E-1. Mechanical Drawing List (Sheet 1 of 2)
Backplate Assembly, 1/3
Backplate Assembly, 2/3
Backplate Assembly, 3/3
Bolster Plate Assembly and Dust Cover

Bolster Plate Assembly, 1/2

Bolster Plate Assembly, 2/2

Heatsink Module Clip (non-Fabric), 1/2

Heatsink Module Clip (non-Fabric), 2/2

Heatsink Module Clip (Fabric), 1/2

Heatsink Module Clip (Fabric), 2/2

Backplate

Backplate Insulator
Back Plate, M3 Stud

Bolster Plate, 1/2

Bolster Plate, 2/2

Bolster Plate, Insulator
Bolster Plate, Small Guide Post
Bolster Plate, Large Guide Post
Bolster Plate, LEC Guide Pin
Bolster Plate, Corner Standoff
Bolster Plate, Spring Assembly
Bolster Plate, Spring
Bolster Plate, Spring Stud, M4
Bolster Plate, Spring Rivet
Bolster Plate, M3 Captive Nut
Bolster Plate, M3 Captive Nut Collar

Socket-P, Dust Cover, 1/2

Socket-P, Dust Cover, 2/2

1U Heatsink Assembly, 1/2 (Reference Only)
1U Heatsink Assembly, 2/2 (Reference Only)
1U Heatsink, 1/2 (Reference Only)
1U Heatsink, 2/2 (Reference Only)
1U Heatsink, Label (Reference Only)
Order Number: 334785-002
lists the mechanical drawings included in this appendix.
Description
® ®
Intel Xeon Phi™ Processor x200 Product Family TMSDG
Figure
Figure E-1
Figure E-2
Figure E-3
Figure E-4
Figure E-5
Figure E-6
Figure E-7
Figure E-8
Figure E-9
Figure E-10
Figure E-11
Figure E-12
Figure E-13
Figure E-14
Figure E-15
Figure E-16
Figure E-17
Figure E-18
Figure E-19
Figure E-20
Figure E-21
Figure E-22
Figure E-23
Figure E-24
Figure E-25
Figure E-26
Figure E-27
Figure E-28
Figure E-29
Figure E-30
Figure E-31
Figure E-32
Figure E-33
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