Mechanical Design Envelope; Board-Level Components Keepout Dimensions; Tall Torsional Clip Heatsink Volumetric Envelope For The Intel 7500 Scalable Memory Buffer - Intel 7512 Thermal/Mechanical Design Manuallines

Reference Thermal Solution 1
5.3

Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or
implementation requirements, the height, width, and depth constraints typically placed
on the component thermal solution are shown in
Any motherboard components placed between the heatsink and motherboard cannot
exceed 2 mm (0.07 in.) in height when using heatsinks that extend beyond the
component reference heatsink envelope shown in
Figure 5-2. Tall Torsional Clip Heatsink Volumetric Envelope for the
®
Intel 7500 Scalable Memory Buffer
Note: All heights shown are maximum values.
5.4

Board-Level Components Keepout Dimensions

The location of hole patterns and keepout zones for the reference thermal solution are
shown in
Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG
Figure 5-3 and Figure 5-4.
Figure 5-2.
Figure 5-2.
23