Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual page 59

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Supplier Listing
Table B-1. Intel Xeon Phi Processor Platform Thermal/Mechanical Assembly Part
Information
Component
Bolster Plate
Assembly
Back Plate
Assembly
Dust Cover
Bolster Plate
with Dust Cover
Assembly
Bolster Plate,
Back Plate and
Dust Cover
Assembly
Order Number: 334785-002
Description
Bolster plate, posts, leaf
spring assembly and
insulator.
Intel P/N
Lotes P/N
Foxconn P/N
Back plate, threaded posts
and insulator
Intel P/N
Lotes P/N
Foxconn P/N
Skt-P plastic handling cover
Intel P/N
Lotes P/N
Foxconn P/N
Bolster plate, posts, leaf
spring assembly and
insulator, Skt-P plastic
handling cover
Intel P/N
Lotes P/N
Foxconn P/N
Bolster plate, posts, leaf
spring assembly and
insulator, back plate,
threaded posts, insulator and
Skt-P plastic handling cover
Intel P/N
Foxconn P/N
Supplier P/N Supplier Contact Info
H77470-008
AZIF0085-P002C*
WNMEL60-80N05-EH
H77469-002
AHSK0009-P002C*
PT44P12-4801
H77975-005
AZIF0084-P002C*
WNMEL00-81N00-EH
H78747-008
AZIF0086-P002C*
PT44L12-4811
NA
WNMEA66-81N02-EH
® ®
Intel Xeon Phi™ Processor x200 Product Family TMSDG
59