Thermal Test Vehicle (Ttv) Correction Factors; Thermal Management Guidelines - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual


Thermal Specifications and Design Guidelines
6.2.3

Thermal Test Vehicle (TTV) Correction Factors

Intel offers thermal test vehicles to assist engineers developing and testing
thermal/mechanical solutions for LGA3647-1 socket-compatible systems. TTVs are
designed to mimic the thermal load of the actual die on the MCP under various work
usage scenarios. The TTV can be used for platforms with and without fabric by simply
turning the fabric die heater on or off.
Correction factors are provided for the processors to correlate the TTV heaters to the
silicon die when analyzing heatsink characterization data.
T
T
Case_MCDRAM_Product
Processor correction factors are subject to change over time. Contact your Intel Xeon
Phi thermal representative if you have questions.
6.2.4

Thermal Management Guidelines

Processor thermal solution, heatsink and/or cold-plate, design must comply with T
targets. Thermal solution design compliance can be determined with thermocouple and
TTV as with previous processors.
Systems that do not monitor the processor temperature by monitoring the DTS (Digital
Thermal Sensor) output must ensure processor cooling solution is capable of meeting
the processor based T
based thermal solutions can reduce average fan power and improve acoustics as
compared to the T
When all cores are active, a properly design thermal solution will be able to meet the
processor thermal specification. When all cores are not active or when Intel
Boost Technology is active, attempting to comply with the DTS based thermal
specification may drive system fans to increased speed. In such situations, the T
temperature will be below the T
6.2.4.1 Processor Absolute Temperatures
Intel does not test any third-party software that reports absolute processor
temperature. As such, Intel cannot recommend the use of software that claims this
capability. Since there is part-to-part variation in the Thermal Control Circuit (TCC)
activation temperature, use of software that reports absolute temperature can be
misleading.
6.2.4.2 Fan Speed Control
Fan Speed Control (FSC) methods are commonly used to reduce system-level acoustic
noise in server designs. Fan speed is one of the key parameters that determines the
amount of airflow provided to the thermal solution. Additionally, airflow is proportional
to a thermal solution's performance, which consequently determines the T
processor at a given power level. Because the T
parameter in determining the long-term reliability of a processor, the FSC implemented
Order Number: 334785-002
= T
Case_CPU_Product Case_CPU_TTV
= T
Case_MCDRAM_TTV
TTV to Product Correction Factors
CF
CPU
0.0006 C/W
specifications. In some situations, implementation of DTS-
CASE
based targets alone.
CASE
CASE
+ CF * (P + P
CPU CPU
+ CF * (P
MCDRAM
based thermal profile by design.
of a processor is an important
CASE
® ®
Intel Xeon Phi™ Processor x200 Product Family TMSDG
+ P )
MCDRAM Fabric
+ P + P
CPU MCDRAM Fabric
CF
MCDRAM
-0.004 C/W
CASE
® Turbo
CASE
of the
CASE
)
51