Heatspreader - Congatec COM Express conga-TC175 User Manual

4.2

Heatspreader

The heatspreader acts as a thermal coupling device to the module and is thermally coupled to the CPU via a thermal gap filler. On some
modules, it may also be thermally coupled to other heat generating components with the use of additional thermal gap fillers. Although the
heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered as a heatsink. It
has been designed as a thermal interface between the module and the application specific thermal solution.
The application specific thermal solution may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some
thermal solutions may also require that the heatspreader is attached directly to the systems chassis thereby using the whole chassis as a heat
dissipater.
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