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SENSATEMP HANDPIECES
Listed below are available SensaTemp handpieces. These items may be ordered directly from PACE or
through your local authorized PACE distributor.
1. SP-2A Sodr-Pen Soldering Iron - P/N 6025-0014 - Provides a wide range of SMD and thru-hole
installation and removal capability as well as unsurpassed thermal performance on heavy
multilayer thru-hole assemblies at safe, lower working temperatures. A wide variety of 3/16"
shank , quick change thru-hole and SMD tips (for chip components, SOTs, SOICs and other
components) are available.
2. SP-1A Sodr-Pen Soldering Iron - P/N 6025-0013 - Uses 1/8" shank tips and features a slimmer,
more compact heater than the SP-2 Sodr-Pen for easier access on densely populated
assemblies.
3. SX-70 Sodr-X-Tractor Handpiece - P/N 6010-0077 - Provides enhanced thermal performance for
safe, rapid desoldering of heavy multilayer thru-hole solder joints. Also ideal for SMD land
preparation on heavy multilayer assemblies. A wide variety of standard, heavy duty and low
cost tips are available.
4. TP-65 ThermoPik Handpiece - P/N 7024-0001 - Provides safe one-handed reflow and removal of
a wide variety of Quad FlatPacks (PQFPs). High thermal efficiency design targets controlled
SensaTemp heat on all solder joints simultaneously without damage to the substrate or
adjacent components.
5. TT-65 ThermoTweez Handpiece - P/N 7025-0001 - Tweezer type device provides safe one-
handed reflow and removal of PLCCs and other components. High thermal capacity and
targeted heat quickly removes SMDs without damage to pcb or adjacent components.
6. TJ-70 Mini ThermoJet Handpiece - P/N 7023-0002 - Precision focused hot air reflow handpiece
provides safe, rapid installation of a wide variety of SMD components. SensaTemp control
provides safe, "on demand" capability without constant running of the air pump.
7. DTP-80 Dual ThermoPik Handpiece - P/N 7029-0001 - Provides safe one-handed reflow and
removal of a wide variety of Quad FlatPacks (PQFPs) in a matter of seconds and can even
remove BGAs (Ball Grid Arrays). High thermal efficiency design targets controlled SensaTemp
heat on all solder joints simultaneously without damage to the substrate or adjacent
components.
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