Quad-Core Intel® Xeon® Processor 5300 Series Considerations; Processor Thermal Parameters And Features; Thermal Control Circuit And Tdp - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series
Considerations
An attachment mechanism must be designed to support the heatsink since there are no
features on the LGA771 socket to directly attach a heatsink. In addition to holding the
heatsink in place on top of the IHS, this mechanism plays a significant role in the
robustness of the system in which it is implemented, in particular:
• Ensuring thermal performance of the TIM applied between the IHS and the
heatsink. TIMs, especially ones based on phase change materials, are very
sensitive to applied pressure: the higher the pressure, the better the initial
performance. TIMs such as thermal greases are not as sensitive to applied
pressure. Refer to
made with TIM selection. Designs should consider possible decrease in applied
pressure over time due to potential structural relaxation in enabled components.
• Ensuring system electrical, thermal, and structural integrity under shock and
vibration events. The mechanical requirements of the attach mechanism depend on
the weight of the heatsink and the level of shock and vibration that the system
must support. The overall structural design of the baseboard and system must be
considered when designing the heatsink attach mechanism. Their design should
provide a means for protecting LGA771 socket solder joints as well as preventing
package pullout from the socket.
Note: The load applied by the attachment mechanism must comply with the package and
socket specifications, along with the dynamic load added by the mechanical shock and
vibration requirements, as identified in
A potential mechanical solution for heavy heatsinks is the direct attachment of the
heatsink to the chassis pan. In this case, the strength of the chassis pan can be utilized
rather than solely relying on the baseboard strength. In addition to the general
guidelines given above, contact with the baseboard surfaces should be minimized
during installation in order to avoid any damage to the baseboard.
The Intel reference design for Quad-Core Intel® Xeon® Processor 5300 Series is using
such a heatsink attachment scheme. Refer to
regarding the Intel reference mechanical solution.
2.2

Processor Thermal Parameters and Features

2.2.1

Thermal Control Circuit and TDP

The operating thermal limits of the processor are defined by the Thermal Profile. The
intent of the Thermal Profile specification is to support acoustic noise reduction through
fan speed control and ensure the long-term reliability of the processor. This
specification requires that the temperature at the center of the processor IHS, known
as (T
CASE
Figure 2-4
Processor 5300 Series package. Compliance with the T
achieve optimal operation and long-term reliability (See the Intel
Multi Processor Family Thermal Test Vehicle User's Guide for Case Temperature
definition and measurement methods).
18
Section 2.4.2
) remains within a certain temperature specification. For illustration,
shows the measurement location for the Quad-Core Intel® Xeon®
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
Thermal/Mechanical Reference Design
and Section 2.4.7.2 for information on tradeoffs
Section 2.1.1.
Section 2.4 for further information
CASE
specification is required to
® ®
Xeon Dual and