Thermal Profile Adherence; Alternative Heatsink Thermal Adherence To Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

1U Alternative Heatsink Thermal/Mechanical Design
A.3

Thermal Profile Adherence

The 1U alternative thermal solution is designed to meet the Thermal Profile for the
Quad-Core Intel® Xeon® Processor E5300 Series in volumetrically constrained form
factors. From
solution is computed to be 0.325 °C/W and the processor local ambient temperature
(T ) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this
LA
thermal solution is calculated as:
Equation A-1. y = 0.325x + 40
where,
y = Processor T
x = Processor power value (W)
Figure A-3
Profile to the Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile
specification. The 1U alternative solution meets the Thermal Profile with 1.8°C margin
at the lower end (P
to Thermal Profile, it is ensured that no measurable performance loss due to TCC
activation is observed under the given environmental conditions.
Figure A-3. 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon®
Processor E5300 Series Thermal Profile
65
60
55
50
45
40
0
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
Table A-1 the three-sigma (mean+3sigma) performance of the thermal
value (°C)
CASE
below shows the comparison of this reference thermal solution's Thermal
) and 0°C margin at the upper end (TDP). By designing
_PROFILE_MIN
T @ TDP
CASE_MAX
T @ P
CASE_MAX
_PROFILE_MIN
5
15 20
10 25
Thermal Profile
Y=0.293*X+42.6
35 40 45 50
30
Power (W)
P
_ PROFILE _MIN
1U CEK Reference Solution
Y=0.325*X+40
75
55 60 65 70
80
TDP
57