Boxed Processor Specifications; Introduction; Boxed Quad-Core Intel® Xeon® Processor 5300 Series 1U Passive/3U+ Active Combination Heat Sink (With Removable Fan) - Intel E5310 - Xeon 1.6 GHz 8M L2 Cache 1066MHz FSB LGA771 Active Quad-Core Processor Datasheet

Boxed Processor Specifications

8
Boxed Processor Specifications
8.1

Introduction

Intel boxed processors are intended for system integrators who build systems from
components available through distribution channels. The Quad-Core Intel® Xeon®
Processor 5300 Series will be offered as an Intel boxed processor.
Intel will offer the Quad-Core Intel® Xeon® Processor 5300 Series boxed processor
with two heat sink configurations available for each processor frequency: 1U passive/
3U+ active combination solution and a 2U passive only solution. The 1U passive/3U+
active combination solution is based on a 1U passive heat sink with a removable fan
that will be pre-attached at shipping. This heat sink solution is intended to be used as
either a 1U passive heat sink, or a 3U+ active heat sink. Although the active
combination solution with removable fan mechanically fits into a 2U keepout, its use is
not recommended in that configuration.
The 1U passive/3U+ active combination solution in the active fan configuration is
primarily designed to be used in a pedestal chassis where sufficient air inlet space is
present and strong side directional airflow is not an issue. The 1U passive/3U+ active
combination solution with the fan removed and the 2U passive thermal solution require
the use of chassis ducting and are targeted for use in rack mount or pedestal servers.
The retention solution used for these products is called the Common Enabling Kit, or
CEK. The CEK base is compatible with both thermal solutions and uses the same hole
locations as the Dual-Core Intel® Xeon® processor 5100 series.
The 1U passive/3U+ active combination solution will utilize a removable fan capable of
4-pin pulse width modulated (PWM) control. Use of a 4-pin PWM controlled active
thermal solution helps customers meet acoustic targets in pedestal platforms through
the motherboards's ability to directly control the RPM of the processor heat sink fan.
See Section 8.3
the PWM and PECI interface along with Digital Thermal Sensors (DTS).
through Figure 8-3
Figure 8-1. Boxed Quad-Core Intel® Xeon® Processor 5300 Series 1U Passive/3U+
Active Combination Heat Sink (With Removable Fan)
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
for more details on fan speed control, and see
are representations of the two heat sink solutions.
Section 6.3 for more on
Figure 8-1
97