Cek Thermal Adherence To Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile B - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

Thermal/Mechanical Reference Design
Figure 2-20. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5300
Series Thermal Profile B
T
CASE_MAX_B
70
65
60
55
50
T
CASE_MAX_B
45
40
0
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile for
the Quad-Core Intel® Xeon® Processor E5300 Series in volumetrically constrained
form factors. From
thermal solution is computed to be 0.249 °C/W and the processor local ambient
temperature (T
equation for this thermal solution is calculated as:
Equation 2-10.y = 0.249x + 40
where,
y = Processor T
x = Processor power value (W)
Figure 2-21
Profile to the Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile
specification. The 1U CEK solution meets the Thermal Profile with 3.7°C margin at the
lower end (P
Thermal Profile, it is ensured that no measurable performance loss due to TCC
activation is observed under the given environmental conditions.
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
@ TDP
@ P
_PROFILE_MIN_B
5 10 20 25 30 35
15
P
_PROFILE_MIN_B
Table 2-5 the three-sigma (mean+3sigma) performance of the
) for this thermal solution is 40 °C. Hence, the Thermal Profile
LA
value (°C)
CASE
below shows the comparison of this reference thermal solution's Thermal
) and 6.1°C margin at the upper end (TDP). By designing to
_PROFILE_MIN
Thermal Profile B
Y = 0.224 * X + 43.1
1U CEK Reference Solution
Y = 0.249 * X + 40
40 45 50 55 60 65
Power (W)
70 75 80 110
90 100
TDP
120
45