Tait TM8100 mobiles Service Manual page 144

144 Disassembly and Reassembly
4. If the thermal paste on the heat-transfer block
cooper plate of the main board
thermal paste must be applied:
Remove any residue of the old thermal paste from both contact
■
surfaces.
Use Dow Corning 340 silicone heat-sink compound
■
(IPN 937-00000-55).
Important
Ensure that no bristles from the brush come loose and
remain embedded in the paste. The paste needs to be
completely free of contaminants.
Use a stiff brush to apply 0.1cm
■
complete contact surface on the tin-plated copper plate (refer to
Figure 5.6 on page
5. Place the main board
push them together to spread the thermal paste.
Important
You must observe the following order of assembly to ensure
that the main board and the connectors are not assembled
under stress.
6. Use a torque-driver with a 3/16 inch (5mm) socket to fasten the
D-range screwlock fasteners
7. Fit the RF connector lock washer
9/16 inch (14mm) long-reach socket to fasten the RF connector nut
1!
to 15lb·in (1.7N·m).
8. Use a torque-driver with a Torx T10 bit to fasten the three screws
to 15lb·in (1.7N·m).
9. Loosen both the D-range screwlock fasteners
RF connector nut
10. Re-tighten both the D-range screwlock fasteners
RF connector nut
11. Fit the power connector seal
1$
has been contaminated, new
3
of thermal paste over the
143).
1$
in position on the heat-transfer block
H
to 8lb·in (0.9N·m).
1@
. Use a torque-driver with a
1!
.
1!
to the torques indicated in steps
I
.
© Tait Electronics Limited November 2007
F
or the tin-plated
F
, and
H
and the
H
and the
7 and 8.
TM8100/TM8200 Service Manual
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