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Figure 5-1.
Comparison of Case Temperature vs. Sensor Based Specification
5.2
Sensor Based Thermal Specification
The sensor based thermal specification consists of two parts. The first is a thermal
profile that defines the maximum TTV T
thermal profile defines the boundary conditions for validation of the thermal solution.
The second part is a defined thermal solution performance (Ψ
DTS value as reported over the PECI bus when DTS is greater than T
defines the operational limits for the processor using the TTV validated thermal
solution.
5.2.1
TTV Thermal Profile
For the sensor based specification the only reference made to a case temperature
measurement is on the TTV. Functional thermal validation will not require the user to
apply a thermocouple to the processor package or measure processor power.
Note:
All functional compliance testing will be based on fan speed response to the reported
DTS values above T
will be necessary.
28
Sensor Based Thermal Specification Design Guidance
Ta = 43.2 C
Ta = 43.2 C
Tcontrol
Tcontrol
Power
Power
Current Specification (Case Temp)
Current Specification (Case Temp)
Ψ-ca = 0.362
Ψ-ca = 0.362
Tcontrol
Tcontrol
Power
Power
Sensor Based Specification (DTS Temp)
Sensor Based Specification (DTS Temp)
CASE
. As a result no conversion of TTV T
CONTROL
Ta = 30 C
Ta = 30 C
Ψ-ca = 0.292
Ψ-ca = 0.292
TDP
TDP
Ψ-ca = 0.292
Ψ-ca = 0.292
Ta = 30 C
Ta = 30 C
TDP
TDP
as a function of TTV power dissipation. The
) as a function of the
CA
CASE
Thermal/Mechanical Design Guide
. This
CONTROL
to processor T
CASE
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