STC micro STC8A8K64D4 Series Reference Manual page 894

STC8A8K64D4 Series Manual
6. Copper plating
The bottom layer can be covered with grid copper or solid copper. Note that the distance between the
copper and the induction plate is 0.5mm. The silk screen information of the top layer is printed on the
button. The frame shape of the silk screen is the same as the bottom sensor plate. The top layer
corresponding to the bottom sensor plate should not be covered with copper, otherwise the touch action
will be shielded. The copper on the top layer is the same as the copper on the bottom layer.
7. Wiring processing
It is better to use a smaller line width for the connection between the sensor plate and the IC, such as
between 10 and 15 mils. The connection between the induction plate and the touch chip should not cross
the lines with strong interference, high frequency, and high current. Do not run other signal lines within
1.5mm of the connection between the sensor pad and the touch chip, the farther away the better. The top
layer corresponds to the bottom sensor plate and connecting line, it is best not to put any line.
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