STC micro STC8A8K64D4 Series Reference Manual page 895

STC8A8K64D4 Series Manual
Appendix T QFN/DFN packaged components
welding method
In the package form of STC products, the more popular QFN and DFN packages have been added. Since the pins
of the chip in this package are at the bottom of the chip, manual soldering is difficult. There are small companies on the
market that specialize in welding engineering samples, which can undertake engineering sample proofing. If users need
to weld by themselves, please refer to the following welding method.
1. Firstly, you need to prepare the following tools: electric soldering iron, hot air gun, tweezers, fixing frame and
other tools
2. The PCB boards and chips that need to be soldered are as follows:
3. Tin the pads of the chip on the board:
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